| 2 |
Approval of Agenda |
|
| R1-2501680 |
Draft Agenda of RAN1#120bis meeting |
RAN1 Chair |
| R1-2501683 |
RAN1#120bis Meeting Timelines, Scope, Process |
RAN1 Chair, ETSI MCC |
| 3 |
Highlights from RAN plenary |
|
| R1-2501681 |
Highlights from RAN#107 and 6G Workshop |
RAN1 Chair |
| 4 |
Approval of Minutes from previous meetings |
|
| R1-2501682 |
Report of RAN1#120 meeting |
ETSI MCC |
| 5 |
Incoming Liaison Statements |
|
| R1-2501684 |
Reply LS on LP-WUS operation in IDLE/INACTIVE mode |
RAN2, vivo |
| R1-2501685 |
Reply LS on LP-WUS operation in CONNECTED mode |
RAN2, NTT DOCOMO |
| R1-2501686 |
LS on number of beam measurements in the measurement report MAC CE |
RAN2, Huawei |
| R1-2501687 |
Reply LS to SA2 |
RAN2, vivo |
| R1-2501688 |
Reply LS on Ku band numerology |
RAN2, Eutelsat |
| R1-2501689 |
Response LS on simultaneous operation between GNSS and NR NTN |
RAN2, Nokia |
| R1-2501690 |
Reply LS on UE capability for FDD-FDD inter-band CA simultaneous Rx/Tx |
RAN2, CATT |
| R1-2501691 |
Reply LS on LP-WUS subgrouping |
RAN2, Huawei |
| R1-2501692 |
LS on paging enhancement in R19 NES |
RAN2, xiaomi |
| R1-2501693 |
Reply LS on SSB adaptation |
RAN2, Apple |
| R1-2501694 |
Reply LS on inter-gNB RACH-less HO in NTN |
RAN3, Nokia |
| R1-2501695 |
Reply LS on LMF-based AI/ML Positioning for case 3b |
RAN3, ZTE |
| R1-2501696 |
SBFD information exchange among gNBs for CLI mitigation |
RAN3, Huawei |
| R1-2501697 |
Reply LS to RAN1 on collision between SSB and RA occasion for LTM |
RAN4, MediaTek |
| R1-2501698 |
LS on L1 CLI measurement |
RAN4, Huawei |
| R1-2501699 |
LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
RAN4, CMCC |
| R1-2501700 |
LS of RAN4 RRM agreements on LB CA via switching |
RAN4, Apple |
| R1-2501701 |
Reply LS on soft satellite switch with re-sync |
RAN4, Huawei |
| R1-2501702 |
LS on switching periods for low-low band switching |
RAN4, AT&T |
| R1-2501703 |
LS on LP-WUS UE RF |
RAN4, vivo |
| R1-2501704 |
LS on NR NB-IoT in-band operation |
RAN4, Ericsson |
| R1-2501705 |
Reply LS to RAN2 on UE capabilities for FR2-NTN |
RAN4, vivo |
| R1-2501731 |
Discussion on RAN2 LS on soft satellite switch with re-sync |
Ericsson |
| R1-2501741 |
Discussion on RAN4 LS on L1 CLI measurement |
MediaTek Inc |
| R1-2501758 |
Discussion on LP-WUS UE RF |
ZTE Corporation, Sanechips |
| R1-2501759 |
Draft reply on LP-WUS UE RF |
ZTE Corporation, Sanechips |
| R1-2501788 |
Draft reply LS to RAN2 on number of beam measurements in the measurement report MAC CE |
ZTE Corporation, Sanechips |
| R1-2501789 |
Draft reply LS to RAN4 on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
ZTE Corporation, Sanechips |
| R1-2501790 |
Discussion on collision handling of SSB and RA occasion for LTM |
ZTE Corporation, Sanechips |
| R1-2501791 |
Draft LS reply on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
vivo |
| R1-2501792 |
Discussion on L1 CLI measurement |
vivo |
| R1-2501793 |
Draft reply LS on number of beam measurements in the measurement report MAC CE |
vivo |
| R1-2501794 |
Draft reply LS on LP-WUS UE RF |
vivo |
| R1-2501854 |
Draft reply LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
MediaTek Inc. |
| R1-2501855 |
Draft reply LS on number of beam measurements in the measurement report MAC CE |
Spreadtrum, UNISOC |
| R1-2501856 |
Draft reply LS on L1 CLI measurement |
Spreadtrum, UNISOC |
| R1-2501857 |
Draft reply LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
Spreadtrum, UNISOC |
| R1-2501904 |
Draft reply LS on soft satellite switch with re-sync |
vivo |
| R1-2501906 |
Draft reply LS on L1 CLI measurement |
ZTE Corporation, Sanechips |
| R1-2501961 |
Discussion on RAN4 LS on L1 CLI measurement |
CATT |
| R1-2501962 |
Draft reply LS on L1 CLI measurement |
CATT |
| R1-2501963 |
Discussion on LS on differentiation of mTRP and sTRP |
CATT |
| R1-2501964 |
Draft reply LS on differentiation of mTRP and sTRP |
CATT |
| R1-2501965 |
Discussion on LS on two TA enhancement for asymmetric DL sTRP/ UL mTRP |
CATT |
| R1-2501966 |
Discussions on LS on number of beam measurements in the measurement report MAC CE |
CATT |
| R1-2501967 |
Draft reply LS on number of beam measurements in the measurement report MAC CE |
CATT |
| R1-2502018 |
Discussion on RAN4 LS of DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
China Telecom |
| R1-2502061 |
Discussion on RAN4 LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
ZTE Corporation, Sanechips |
| R1-2502081 |
Draft LS reply on DL timing reference to support two TA enhancement for asymmetric DL sTRP UL mTRP |
NEC |
| R1-2502112 |
Discussion on LS on differentiation of sTRP and sDCI mTRP |
Lenovo |
| R1-2502113 |
Reply LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP UL mTRP |
Lenovo |
| R1-2502114 |
Reply LS on number of beam measurements in the measurement report MAC CE |
Lenovo |
| R1-2502144 |
Discussion on RAN4 LS on L1 CLI measurement |
CMCC |
| R1-2502145 |
Discussion on Reply LS on soft satellite switch with re-sync |
CMCC |
| R1-2502146 |
Discussion on LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP UL mTRP |
CMCC |
| R1-2502147 |
Draft reply on LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP UL mTRP |
CMCC |
| R1-2502148 |
Discussion on LS on number of beam measurements in the measurement report MAC CE |
CMCC |
| R1-2502255 |
Discussion on LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP |
OPPO |
| R1-2502256 |
Discussion on LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
OPPO |
| R1-2502281 |
Discussion on RAN4 LS for L1 CLI measurement |
OPPO |
| R1-2502300 |
Discussion on LS on number of beam measurements in the measurement report MAC CE |
OPPO |
| R1-2502346 |
Discussion on RAN4 reply LS on soft satellite switch with re-sync |
Samsung |
| R1-2502347 |
Draft reply LS to RAN2 LS on number of beam measurement(s) in beam measurement report MAC CE |
Samsung |
| R1-2502348 |
Discussion on RAN4 reply LS on signal configuration LP-WUS and LP-SS |
Samsung |
| R1-2502349 |
Draft reply LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
Samsung |
| R1-2502350 |
Draft reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP |
Samsung |
| R1-2502351 |
Discussion on LS reply to RAN4 on L1 CLI measurement |
Samsung |
| R1-2502408 |
Discussion on RAN4 LS on CLI measurement |
Nokia, Nokia Shanghai Bell |
| R1-2502423 |
Discussion on RAN4 LS on L1 CLI measurement |
Ericsson |
| R1-2502424 |
[Draft] Reply to RAN4 LS on L1 CLI measurement |
Ericsson |
| R1-2502427 |
Discussion on RAN4 LS on L1 CLI measurement |
Xiaomi |
| R1-2502428 |
Discussion on the LS on soft satellite switch with re-sync |
Xiaomi |
| R1-2502429 |
Draft reply LS on DL timing reference issue for Rel-19 MIMO |
Xiaomi |
| R1-2502523 |
Draft LS reply on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
Nokia |
| R1-2502535 |
Discussion of LS response related to soft satellite switch with re-sync |
Nokia |
| R1-2502564 |
Discussion on RAN2 LS on number of beam measurements in the measurement report MAC CE |
Ericsson |
| R1-2502590 |
Discussion on the RAN4 LS on LP-WUS UE RF |
Apple |
| R1-2502591 |
[Draft] Reply LS on LP-WUS UE RF |
Apple |
| R1-2502592 |
[Draft] Reply LS on number of beams in the measurement report MAC CE |
Apple |
| R1-2502593 |
Discussion on RAN4 LS on RRM aspects for LB CA via switching |
Apple |
| R1-2502654 |
Discussion on Reply LS on collision between SSB and RA occasion for LTM |
Nokia |
| R1-2502655 |
Discussion on LS on number of beam measurements in the measurement report MAC CE |
Nokia |
| R1-2502754 |
Discussion on LS on L1 CLI measurement |
NTT DOCOMO, INC. |
| R1-2502800 |
Discussion on RAN4 LS on LP-WUS UE RF |
Ericsson |
| R1-2502825 |
Draft reply LS on L1 CLI measurement |
Qualcomm Incorporated |
| R1-2502826 |
Discussion on response to RAN4 LS on LP-WUS UE RF |
Qualcomm Incorporated |
| R1-2502827 |
Discussion for LS reply on DL timing reference to support two TA enhancement for asymmetric DL sTRP and UL mTRP |
Qualcomm Incorporated |
| R1-2502885 |
Draft reply of LS on number of beam measurements in the measurement report MAC CE |
Google |
| R1-2502886 |
Draft reply of LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP and UL mTRP |
Google |
| R1-2502887 |
Discussion on RAN4 LS on collision between SSB and RA occasion for LTM |
Google |
| R1-2502892 |
Correction on handling collision of SSB and RA occasion for LTM |
Google |
| R1-2502893 |
Draft reply LS on differentiation of sDCI mTRP, mDCI mTRP and sTRP |
vivo |
| R1-2502935 |
Discussion on RAN4 LS on switching periods for low-low band switching |
Ericsson |
| R1-2502936 |
Discussion on RAN4 LS on RRM aspects for LB CA via switching |
Ericsson |
| R1-2502943 |
Discussion on RAN4 LS on L1 CLI measurement |
Huawei, HiSilicon |
| R1-2502944 |
Draft reply LS on L1 CLI measurement |
Huawei, HiSilicon |
| R1-2502945 |
Draft reply LS on LP-WUS UE RF |
Huawei, HiSilicon |
| R1-2502946 |
Discussion on the RAN2 LS on number of beam measurements in the measurement report MAC CE |
Huawei, HiSilicon |
| R1-2502947 |
Draft Reply LS on number of beam measurements in the measurement report MAC CE |
Huawei, HiSilicon |
| R1-2502948 |
Discussion on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
Huawei, HiSilicon |
| R1-2502949 |
Discussion on differentiation of sDCI mTRP, mDCI mTRP and sTRP |
Huawei, HiSilicon |
| R1-2502950 |
Discussion on the RAN4 LS on soft satellite switch with re-sync |
Huawei, HiSilicon |
| R1-2503019 |
Summary on LS on differentiation of sDCI mTRP and sTRP |
Moderator (CATT) |
| R1-2503105 |
Reply LS on signalling feasibility of dataset and parameter sharing |
RAN2, xiaomi, Ericsson |
| 9 |
Release 19 |
|
| R1-2503148 |
TS 38.291 V0.1.0 - Ambient IoT Physical layer |
Huawei |
| 9.1 |
Artificial Intelligence (AI)/Machine Learning (ML) for NR Air Interface (NR_AIML_Air) |
|
| R1-2502828 |
Rapporteur view on higher layer signalling of Rel-19 AI-ML for NR air interface |
Qualcomm Incorporated |
| R1-2503111 |
Session notes for 9.1 (AI/ML for NR Air Interface) |
Ad-Hoc Chair (CMCC) |
| 9.1.1 |
Specification support for beam management |
|
| R1-2501717 |
Discussion on specification support for AI/ML-based beam management |
FUTUREWEI |
| R1-2501751 |
Specification Support for AI/ML for Beam Management |
Kyocera |
| R1-2501775 |
AI/ML for beam management |
Ericsson |
| R1-2501795 |
Specification support for beam management |
vivo |
| R1-2501858 |
Discussion on AIML for beam management |
Spreadtrum, UNISOC |
| R1-2501905 |
Discussion on AI/ML-based beam management |
ZTE Corporation, Sanechips |
| R1-2501938 |
Specification support for AI-enabled beam management |
NVIDIA |
| R1-2501946 |
AI/ML based Beam Management |
Google |
| R1-2501959 |
Discussion on AIML beam management |
TCL |
| R1-2501968 |
Specification support for AI/ML-based beam management |
CATT |
| R1-2502036 |
Discussion on AI/ML for beam management |
Ofinno |
| R1-2502066 |
Discussion on specification support for beam management |
Panasonic |
| R1-2502078 |
Discussion on specification support for beam management |
NEC |
| R1-2502097 |
Specification support for beam management |
Tejas Network Limited |
| R1-2502099 |
Discussions on AI/ML for beam management |
LG Electronics |
| R1-2502115 |
Discussion on specification support on AI/ML for beam management |
Fujitsu |
| R1-2502149 |
Discussion on specification support for beam management |
CMCC |
| R1-2502193 |
AI/ML specification support for beam management |
Lenovo |
| R1-2502210 |
Discussion on AIML for beam management |
Huawei, HiSilicon |
| R1-2502288 |
On specification for AI/ML-based beam management |
OPPO |
| R1-2502301 |
Discussion on AI/ML for beam management |
InterDigital, Inc. |
| R1-2502309 |
Discussion on specification support for beam management |
Sony |
| R1-2502352 |
Discussion for supporting AI/ML based beam management |
Samsung |
| R1-2502411 |
Discussion on specification support for beam management |
Ruijie Networks Co. Ltd |
| R1-2502430 |
Discussion on AI/ML for beam management |
Xiaomi |
| R1-2502501 |
Discussion on specification support for beam management |
ETRI |
| R1-2502528 |
AI/ML for Beam Management |
Nokia |
| R1-2502537 |
Discussion on specification support for AI/ML beam management |
Transsion Holdings |
| R1-2502585 |
Specification support for AI/ML beam management |
ITL |
| R1-2502594 |
AI/ML for beam management |
Apple |
| R1-2502683 |
Discussions on specification support for beam management |
Sharp |
| R1-2502686 |
Discussion on AI/ML for beam management |
HONOR |
| R1-2502700 |
Specification support for beam management |
KDDI Corporation (TTC) |
| R1-2502701 |
Discussion on specification support for AIML-based beam management |
MediaTek Inc. |
| R1-2502728 |
Discussion on AI/ML based beam management |
KT Corp. |
| R1-2502755 |
Discussion on AI/ML for beam management |
NTT DOCOMO, INC. |
| R1-2502829 |
Specification support for AI-ML-based beam management |
Qualcomm Incorporated |
| R1-2502876 |
Discussion on AIML based beam management |
ASUSTeK |
| R1-2502894 |
On Performance Monitoring for Beam Management Use Case |
NTU |
| R1-2502895 |
Specification support for beam management |
Fraunhofer HHI, Fraunhofer IIS |
| R1-2503040 |
FL summary #0 for AI/ML in beam management |
Moderator (Samsung) |
| R1-2503041 |
FL summary #1 for AI/ML in beam management |
Moderator (Samsung) |
| R1-2503042 |
FL summary #2 for AI/ML in beam management |
Moderator (Samsung) |
| R1-2503043 |
FL summary #3 for AI/ML in beam management |
Moderator (Samsung) |
| R1-2503044 |
FL summary #4 for AI/ML in beam management |
Moderator (Samsung) |
| 9.1.2 |
Specification support for positioning accuracy enhancement |
|
| R1-2501796 |
Specification support for positioning accuracy enhancement |
vivo |
| R1-2501859 |
Discussion on AIML for positioning accuracy enhancement |
Spreadtrum, UNISOC |
| R1-2501917 |
Discussion on AI/ML-based positioning enhancement |
ZTE Corporation, Pengcheng Laboratory |
| R1-2501925 |
Discussion on support for AIML positioning |
InterDigital, Inc. |
| R1-2501940 |
Specification support for AI-enabled positioning |
NVIDIA |
| R1-2501947 |
AI/ML based Positioning |
Google |
| R1-2501969 |
Specification support for AI/ML-based positioning |
CATT, CICTCI |
| R1-2502064 |
Discussion on specification support for positioning accuracy enhancement |
TCL |
| R1-2502071 |
Discussion on specification support for AIML based positioning accuracy enhancement |
NEC |
| R1-2502098 |
Specification support for positioning accuracy enhancement |
Tejas Network Limited |
| R1-2502116 |
Discussion on specification support for AIML-based positioning accuracy enhancement |
Fujitsu |
| R1-2502150 |
Discussion on specification support for positioning accuracy enhancement |
CMCC |
| R1-2502194 |
Specification impacts for AI/ML positioning |
Lenovo |
| R1-2502211 |
Discussion on AI/ML for positioning accuracy enhancement |
Huawei, HiSilicon |
| R1-2502289 |
On specification for AI/ML-based positioning accuracy enhancements |
OPPO |
| R1-2502310 |
Discussion on Specification support for positioning accuracy enhancement |
Sony |
| R1-2502353 |
Discussion for supporting AI/ML based positioning accuracy enhancement |
Samsung |
| R1-2502412 |
Discussion on specification support for positioning accuracy enhancement |
Ruijie Networks Co. Ltd |
| R1-2502431 |
Discussion on AI/ML-based positioning accuracy enhancement |
Xiaomi |
| R1-2502502 |
Discussion on specification support for positioning accuracy enhancement |
ETRI |
| R1-2502529 |
AI/ML for Positioning Accuracy Enhancement |
Nokia |
| R1-2502561 |
AI/ML positioning accuracy enhancement |
Fraunhofer IIS, Fraunhofer HHI |
| R1-2502595 |
Specification Support for AI/ML-based positioning |
Apple |
| R1-2502660 |
AI/ML for Positioning Accuracy Enhancement |
Ericsson |
| R1-2502663 |
Design for AI/ML based positioning |
MediaTek Korea Inc. |
| R1-2502684 |
Discussion on specification support for AI/ML based positioning accuracy enhancements |
Sharp |
| R1-2502756 |
Discussion on AI/ML for positioning accuracy enhancement |
NTT DOCOMO, INC. |
| R1-2502830 |
Specification support for AI-ML-based positioning accuracy enhancement |
Qualcomm Incorporated |
| R1-2502911 |
Discussion on specification support for AI/ML positioning accuracy enhancement |
CEWiT |
| R1-2502933 |
Discussions on specification support for positioning accuracy enhancement for AI/ML |
ITL |
| R1-2502987 |
Summary #1 of specification support for positioning accuracy enhancement |
Moderator (Ericsson) |
| R1-2502988 |
Summary #2 of specification support for positioning accuracy enhancement |
Moderator (Ericsson) |
| R1-2502989 |
Summary #3 of specification support for positioning accuracy enhancement |
Moderator (Ericsson) |
| R1-2502990 |
Summary #4 of specification support for positioning accuracy enhancement |
Moderator (Ericsson) |
| R1-2502991 |
Summary #5 of specification support for positioning accuracy enhancement |
Moderator (Ericsson) |
| R1-2503144 |
Final summary of specification support for positioning accuracy enhancement |
Moderator (Ericsson) |
| 9.1.3 |
Specification support for CSI prediction |
|
| R1-2501797 |
Specification support for CSI prediction |
vivo |
| R1-2501848 |
Discussion on AI-based CSI prediction |
TCL |
| R1-2501860 |
Discussion on AIML for CSI prediction |
Spreadtrum, UNISOC |
| R1-2501918 |
Discussion on specification support for AI CSI prediction |
ZTE Corporation, Sanechips |
| R1-2501923 |
AI/ML for CSI prediction |
Ericsson |
| R1-2501931 |
Discussion on CSI Processing Unit |
FUTUREWEI |
| R1-2501939 |
Specification support for AI-enabled CSI prediction |
NVIDIA |
| R1-2501945 |
Discussions on AI/ML for CSI prediction |
KT Corp. |
| R1-2501948 |
AI/ML based CSI Prediction |
Google |
| R1-2501970 |
Specification support for AI/ML-based CSI prediction |
CATT |
| R1-2502072 |
Discussion on specification support for CSI prediction |
NEC |
| R1-2502100 |
Discussions on CSI prediction |
LG Electronics |
| R1-2502117 |
Discussion on specification support for CSI prediction |
Fujitsu |
| R1-2502151 |
Discussion on AI/ML for CSI prediction |
CMCC |
| R1-2502195 |
Specification support for CSI prediction |
Lenovo |
| R1-2502212 |
Discussion on AIML for CSI prediction |
Huawei, HiSilicon |
| R1-2502290 |
On specification for AI/ML-based CSI prediction |
OPPO |
| R1-2502311 |
Specification Support for AI/ML CSI prediction |
Sony |
| R1-2502337 |
On AI/ML-based CSI prediction |
InterDigital, Inc. |
| R1-2502354 |
Views on AI/ML based CSI prediction |
Samsung |
| R1-2502413 |
Discussion on specification support for CSI prediction |
Ruijie Networks Co. Ltd |
| R1-2502432 |
Further discussion on AI/ML model based CSI prediction |
Xiaomi |
| R1-2502472 |
Specification support for CSI Prediction |
Tejas Network Limited |
| R1-2502491 |
Discussion on AI/ML-based CSI prediction |
Panasonic |
| R1-2502503 |
Discussion on specification support for CSI prediction |
ETRI |
| R1-2502530 |
AI/ML for CSI Prediction |
Nokia |
| R1-2502567 |
Specification support for CSI prediction |
Continental Automotive |
| R1-2502596 |
Discussion on AI based CSI prediction |
Apple |
| R1-2502685 |
Discussion on specification support for AI/ML based CSI prediction |
Sharp |
| R1-2502702 |
AI/ML - Specification support for CSI Prediction |
MediaTek Inc. |
| R1-2502735 |
Discussion on AI/ML for CSI prediction |
AT&T |
| R1-2502757 |
Discussion on AI/ML for CSI prediction |
NTT DOCOMO, INC. |
| R1-2502831 |
Specification support for CSI prediction |
Qualcomm Incorporated |
| R1-2503056 |
Summary #1 of CSI prediction |
Moderator (LG Electronics) |
| R1-2503057 |
Summary #2 of CSI prediction |
Moderator (LG Electronics) |
| R1-2503058 |
Summary #3 of CSI prediction |
Moderator (LG Electronics) |
| R1-2503059 |
Summary #4 of CSI prediction |
Moderator (LG Electronics) |
| R1-2503139 |
Summary #5 of CSI prediction |
Moderator (LG Electronics) |
| 9.1.4.1 |
CSI compression and any other aspects on AI/ML model/data |
|
| R1-2501718 |
Discussion of CSI compression on AI/ML for NR air interface |
FUTUREWEI |
| R1-2501798 |
Discussion on CSI compression and other aspects on AI/ML model/data |
vivo |
| R1-2501861 |
Discussion on AIML for CSI compression |
Spreadtrum, UNISOC |
| R1-2501919 |
Discussion on study for AI/ML CSI compression |
ZTE Corporation, Sanechips |
| R1-2501924 |
AI/ML for CSI compression and other aspects on AI/ML model/data |
Ericsson |
| R1-2501934 |
Additional study on AI-enabled CSI compression and other aspects of AI model and data |
NVIDIA |
| R1-2501949 |
AI/ML based CSI Compression |
Google |
| R1-2501958 |
Discussion on AIML CSI compression |
TCL |
| R1-2501971 |
Discussion on AI/ML-based CSI compression |
CATT |
| R1-2502037 |
Views on UCI loss mitigation |
Ofinno |
| R1-2502073 |
Discussion CSI compression |
NEC |
| R1-2502096 |
Discussion on CSI Compression and other aspects of AIML |
Tejas Network Limited |
| R1-2502101 |
Study on CSI compression |
LG Electronics |
| R1-2502118 |
Discussion on CSI compression with AI/ML |
Fujitsu |
| R1-2502152 |
Discussion on AI/ML for CSI compression |
CMCC |
| R1-2502196 |
On AI/ML for CSI compression |
Lenovo |
| R1-2502213 |
Discussion on AI/ML for CSI compression |
Huawei, HiSilicon |
| R1-2502291 |
Additional study on AI/ML-based CSI compression |
OPPO |
| R1-2502338 |
On AI/ML-based CSI compression and other aspects |
InterDigital, Inc. |
| R1-2502355 |
Views on additional study for AI/ML based CSI compression |
Samsung |
| R1-2502433 |
Discussion on AI/ML model based CSI compression and other aspects on AI/ML model/data |
Xiaomi |
| R1-2502489 |
AI/ML for CSI feedback enhancement |
Mavenir |
| R1-2502492 |
Discussion on AI/ML for CSI compression |
Panasonic |
| R1-2502504 |
Discussion on AI/ML for CSI compression |
ETRI |
| R1-2502531 |
AI/ML for CSI Compression |
Nokia |
| R1-2502571 |
CSI compression and other aspects on AI/ML model/data |
Continental Automotive |
| R1-2502597 |
Discussion on AI based CSI compression and AI processing units |
Apple |
| R1-2502703 |
Additional study on AI/ML for NR air interface - CSI compression |
MediaTek Inc. |
| R1-2502758 |
Discussion on AI/ML for CSI compression |
NTT DOCOMO, INC. |
| R1-2502832 |
Additional study on CSI compression |
Qualcomm Incorporated |
| R1-2502912 |
Discussion on AI/ML for CSI Compression |
CEWiT |
| R1-2502934 |
Discussion on AI/ML-based CSI compression |
Pengcheng laboratory |
| R1-2502937 |
Discussion on AI/ML model-based CSI compression |
IIT Kanpur |
| R1-2502952 |
AI/ML for CSI compression and other aspects on AI/ML model/data |
Ericsson |
| R1-2502996 |
Discussion of CSI compression on AI/ML for NR air interface |
FUTUREWEI |
| R1-2503028 |
Summary#1 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data |
Moderator (Qualcomm) |
| R1-2503029 |
Summary#2 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data |
Moderator (Qualcomm) |
| R1-2503030 |
Summary#3 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data |
Moderator (Qualcomm) |
| R1-2503031 |
Summary#4 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data |
Moderator (Qualcomm) |
| R1-2503032 |
Summary#5 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data |
Moderator (Qualcomm) |
| R1-2503033 |
Summary#6 of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data |
Moderator (Qualcomm) |
| R1-2503034 |
Final summary of Additional study on AI/ML for NR air interface: CSI compression and any other aspects on AI/ML model/data |
Moderator (Qualcomm) |
| 9.2 |
NR MIMO Phase 5 (NR_MIMO_Ph5) |
|
| R1-2502361 |
List of RRC impact for Rel-19 MIMO Ph5 |
Moderator (Samsung) |
| R1-2502362 |
Draft LS to RAN2 on MAC impact for Rel-19 MIMO Ph5 |
Moderator (Samsung) |
| R1-2502363 |
LS to RAN2 on MAC impact for Rel-19 MIMO Ph5 |
Moderator (Samsung) |
| R1-2502364 |
Draft Stage-2 CR for Rel-19 NR MIMO Ph5 in TS38.300 |
Samsung |
| R1-2503093 |
Summary of discussion on Draft CR on TS38.300 for Rel-19 MIMO |
Moderator (Samsung) |
| 9.2.1 |
Enhancements for UE-initiated/event-driven beam management |
|
| R1-2501716 |
Enhancements for UE-initiated/event-driven beam management |
FUTUREWEI |
| R1-2501742 |
On Specifications of Rel-19 UE/Event-Driven Beam Management |
InterDigital, Inc. |
| R1-2501780 |
Discussion on enhancements for UE-initiated/event-driven beam management |
ZTE Corporation, Sanechips |
| R1-2501799 |
Remaining issues on UE-initiated/event-driven beam management |
vivo |
| R1-2501850 |
Enhancements for UE-initiated/event-driven beam management |
MediaTek Inc. |
| R1-2501862 |
Discussion on UE-initiated/event-driven beam management |
Spreadtrum, UNISOC |
| R1-2501985 |
On enhancements for UE-initiated/event-driven beam management |
CATT |
| R1-2502038 |
On UE-initiated/event-driven beam management |
Ofinno |
| R1-2502053 |
Remaining issues for UE-initiated beam management |
Ericsson |
| R1-2502065 |
Discussions on UEIBM |
China Telecom |
| R1-2502079 |
Discussion on enhancements for UE-initiated or event-driven beam management |
NEC |
| R1-2502103 |
UE-initiated beam management |
LG Electronics |
| R1-2502107 |
Enhancements for UE-initiated/event-driven beam management |
Lenovo |
| R1-2502119 |
Discussion on enhancements for UE-initiated/event-driven beam management |
Fujitsu |
| R1-2502153 |
Discussion on enhancements for UE-initiated/event-driven beam management |
CMCC |
| R1-2502224 |
On UE initiated/event-driven beam management |
Huawei, HiSilicon |
| R1-2502293 |
Discussions on UE-initiated/event-driven beam management |
OPPO |
| R1-2502312 |
Enhancements for UE-initiated/event-driven beam management |
Sony |
| R1-2502356 |
Views on Rel-19 UE-initiated/event-driven beam management |
Samsung |
| R1-2502414 |
Discussion on enhancements for UE-initiated/event-driven beam management |
Ruijie Networks Co. Ltd |
| R1-2502434 |
Discussion on enhancements for UE-initiated/event-driven beam management |
Xiaomi |
| R1-2502505 |
Enhancements for UE-initiated/event-driven beam management |
ETRI |
| R1-2502524 |
Enhancements to facilitate UE-initiated/event-driven beam management |
Nokia |
| R1-2502538 |
Enhancements for UE-initiated/event-driven beam management |
Transsion Holdings |
| R1-2502545 |
Discussion on UE-initiated/event-driven beam management |
TCL |
| R1-2502598 |
Remaining issues for UE-initiated beam management |
Apple |
| R1-2502665 |
Enhancements for UE-initiated/event-driven beam management |
Sharp |
| R1-2502687 |
Discussion on the UE-initiated/event-driven beam management |
HONOR |
| R1-2502744 |
Offline summary for Rel-19 MIMO UEIBM (9.2.1) pre-RAN1#120b |
Moderator (ZTE) |
| R1-2502745 |
Moderator Summary #1 on UE-initiated/event-driven beam management |
Moderator (ZTE) |
| R1-2502746 |
Moderator Summary #2 on UE-initiated/event-driven beam management |
Moderator (ZTE) |
| R1-2502747 |
Moderator Summary #3 on UE-initiated/event-driven beam management |
Moderator (ZTE) |
| R1-2502759 |
Discussion on enhancements for UE-initiated/event-driven beam management |
NTT DOCOMO, INC. |
| R1-2502793 |
Discussion on UE-initiated/event-driven beam management |
ITRI |
| R1-2502812 |
Enhancements for UE-initiated/event-driven beam management |
Panasonic |
| R1-2502833 |
UE-initiated/event-driven beam management |
Qualcomm Incorporated |
| R1-2502877 |
Discussion on UE initiated beam report |
ASUSTeK |
| R1-2502888 |
Discussion on enhancements for UE-initiated or event-driven beam management |
Google |
| R1-2502897 |
Discussions on enhancements for UE-initiated/event-driven beam management |
KDDI Corporation (TTC) |
| R1-2503092 |
Moderator Summary #4 on UE-initiated/event-driven beam management |
Moderator (ZTE) |
| 9.2.2 |
CSI enhancements |
|
| R1-2501743 |
On Specifications of Rel-19 Enhancements of CSI |
InterDigital, Inc. |
| R1-2501781 |
Discussion on CSI enhancements |
ZTE Corporation, Sanechips |
| R1-2501800 |
Remaining issues on Rel-19 CSI enhancements |
vivo |
| R1-2501851 |
CSI enhancements |
MediaTek Inc. |
| R1-2501863 |
Discussion on CSI enhancements |
Spreadtrum, UNISOC |
| R1-2501950 |
CSI Enhancement for NR MIMO |
Google |
| R1-2501986 |
Remaining issues on CSI enhancements for NR MIMO Phase 5 |
CATT |
| R1-2502011 |
Discussion on Rel-19 CSI Enhancements |
Tejas Network Limited |
| R1-2502074 |
Discussion on CSI enhancements |
NEC |
| R1-2502108 |
Discussion on CSI enhancements |
Lenovo |
| R1-2502120 |
Remaining issues on Rel-19 CSI enhancements |
Fujitsu |
| R1-2502154 |
Discussion on CSI enhancements |
CMCC |
| R1-2502225 |
On 128 CSI-RS ports and UE reporting enhancement |
Huawei, HiSilicon |
| R1-2502294 |
CSI enhancements for Rel-19 MIMO |
OPPO |
| R1-2502313 |
Further discussion of CSI enhancements |
Sony |
| R1-2502357 |
Moderator Summary#1 on Rel-19 CSI enhancements: Round 1 |
Moderator (Samsung) |
| R1-2502358 |
Views on Rel-19 CSI enhancements |
Samsung |
| R1-2502435 |
Maintenance on CSI enhancement for up to 128 ports and CJT |
Xiaomi |
| R1-2502506 |
Discussion on CSI enhancements for NR MIMO Phase 5 |
ETRI |
| R1-2502525 |
CSI enhancement for NR MIMO Phase 5 |
Nokia |
| R1-2502551 |
Discussion on the Remaining Issues of CSI Enhancement |
Rakuten Mobile, Inc |
| R1-2502599 |
Views on R19 MIMO CSI enhancement |
Apple |
| R1-2502666 |
CSI enhancements |
Sharp |
| R1-2502688 |
Discussion on CSI enhancements |
HONOR |
| R1-2502730 |
Discussion on Beamforming Template for CSI Enhancement |
China Unicom |
| R1-2502760 |
Discussion on CSI enhancements |
NTT DOCOMO, INC., NTT CORPORATION |
| R1-2502811 |
Maintenance on CSI for large antenna arrays and CJT |
Ericsson |
| R1-2502834 |
CSI enhancements for >32 ports and UE-assisted CJT |
Qualcomm Incorporated |
| R1-2502904 |
CSI enhancements for Rel. 19 MIMO |
Fraunhofer IIS, Fraunhofer HHI |
| R1-2502932 |
Discussion on CSI enhancements for NR MIMO Phase 5 |
KDDI Corporation |
| R1-2503011 |
Moderator Summary#2 on Rel-19 CSI enhancements: Round 2 |
Moderator (Samsung) |
| R1-2503012 |
Moderator Summary#3 on Rel-19 CSI enhancements: Round 3 |
Moderator (Samsung) |
| R1-2503013 |
Moderator Summary for 1st offline on Rel-19 CSI enhancements |
Moderator (Samsung) |
| 9.2.3 |
Support for 3-antenna-port codebook-based transmissions |
|
| R1-2501744 |
On Specifications of Rel-19 CB-based UL for 3TX UE |
InterDigital, Inc. |
| R1-2501746 |
FL Summary Support for 3TX CB-based Uplink; First Round |
Moderator (InterDigital, Inc.) |
| R1-2501747 |
FL Summary Support for 3TX CB-based Uplink; Second Round |
Moderator (InterDigital, Inc.) |
| R1-2501748 |
Summary of Discussion on 3TX CB-based Uplink in RAN1#120bis |
Moderator (InterDigital, Inc.) |
| R1-2501782 |
Discussion on 3-antenna-port codebook-based transmissions |
ZTE Corporation, Sanechips |
| R1-2501801 |
Remaining issues on 3-antenna-port codebook-based uplink transmissions |
vivo |
| R1-2501852 |
3-antenna-port UL transmissions |
MediaTek Inc. |
| R1-2501941 |
Remaining issues for 3 Tx UL transmissions |
Ericsson Japan K.K. |
| R1-2501951 |
Uplink 3 Port Codebook based Transmission |
Google |
| R1-2501987 |
Remaining issues on 3-antenna-port uplink transmission |
CATT |
| R1-2502109 |
Support for 3-antenna-port codebook-based transmissions |
Lenovo |
| R1-2502155 |
Discussion on support for 3-antenna-port codebook-based transmissions |
CMCC |
| R1-2502226 |
Discussion on 3-antenna-port UL transmission |
Huawei, HiSilicon |
| R1-2502295 |
Discussion on 3-antenna-port uplink transmissions |
OPPO |
| R1-2502359 |
Views on Rel-19 3-antenna-port codebook-based transmissions |
Samsung |
| R1-2502436 |
Discussion on the support of 3-antenna-port CB based transmissions |
Xiaomi |
| R1-2502526 |
On the support for 3-antenna-port codebook-based transmissions |
Nokia |
| R1-2502600 |
Remaining issues on R19 MIMO 3Tx transmission |
Apple |
| R1-2502667 |
Support for 3-antenna-port transmission |
Sharp |
| R1-2502761 |
Discussion on support for 3-antenna-port codebook-based transmissions |
NTT DOCOMO, INC. |
| 9.2.4 |
Enhancement for asymmetric DL sTRP/UL mTRP scenarios |
|
| R1-2501745 |
On Specifications of Rel-19 Asymmetric mTRP Operation |
InterDigital, Inc. |
| R1-2501783 |
Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios |
ZTE Corporation, Sanechips, China Telecom |
| R1-2501802 |
Remaining issues on asymmetric DL sTRP/UL mTRP scenarios |
vivo |
| R1-2501853 |
Enhancement for asymmetric DL sTRP/UL mTRP scenarios |
MediaTek Inc. |
| R1-2501864 |
Enhancements for asymmetric DL sTRP/UL mTRP scenarios |
Spreadtrum, UNISOC |
| R1-2501988 |
Discussion on enhancements for asymmetric DL sTRP and UL mTRP scenarios |
CATT |
| R1-2502012 |
Enhancement for asymmetric DL sTRP UL mTRP |
Tejas Network Limited |
| R1-2502019 |
Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios |
China Telecom, ZTE |
| R1-2502039 |
Enhancements on asymmetric DL STRP/UL MTRP scenarios |
Ofinno |
| R1-2502080 |
Discussion on enhancements for asymmetric DL sTRP and UL mTRP scenarios |
NEC |
| R1-2502104 |
Discussions on asymmetric DL sTRP/UL mTRP scenarios |
LG Electronics |
| R1-2502105 |
Remaining issues on asymmetric DL sTRP UL mTRP scenarios |
Ericsson |
| R1-2502106 |
Remaining issues on asymmetric DL sTRP UL mTRP scenarios |
Ericsson |
| R1-2502110 |
Enhancement for asymmetric DL sTRP/UL mTRP scenarios |
Lenovo |
| R1-2502156 |
Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios |
CMCC |
| R1-2502227 |
Enhancements for asymmetric DL sTRP/UL mTRP scenarios |
Huawei, HiSilicon |
| R1-2502296 |
Enhancements on asymmetric DL sTRP/UL mTRP scenarios |
OPPO |
| R1-2502314 |
Enhancement for asymmetric DL sTRP/UL mTRP scenarios |
Sony |
| R1-2502360 |
Views on Rel-19 asymmetric DL sTRP/UL mTRP scenarios |
Samsung |
| R1-2502437 |
Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios |
Xiaomi |
| R1-2502507 |
Discussion on asymmetric UL MIMO operation |
ETRI |
| R1-2502527 |
Enhancement for asymmetric DL sTRP/UL mTRP scenarios |
Nokia |
| R1-2502536 |
Discussion on asymmetric DL sTRP/UL mTRP scenarios |
TCL |
| R1-2502539 |
Discussion on enhancements for asymmetric DL sTRP/UL mTRP scenarios |
Transsion Holdings |
| R1-2502601 |
Enhancements for asymmetric DL sTRP/UL mTRP scenarios |
Apple |
| R1-2502670 |
Enhancement for asymmetric DL sTRP/UL mTRP scenarios |
Sharp |
| R1-2502762 |
Discussion on enhancement for asymmetric DL sTRP/UL mTRP scenarios |
NTT DOCOMO, INC. |
| R1-2502813 |
Enhancement for asymmetric DL sTRP/UL mTRP scenarios |
Panasonic |
| R1-2502835 |
Enhancement for asymmetric DL sTRP and UL mTRP deployment scenarios |
Qualcomm Incorporated |
| R1-2502889 |
Discussion on enhancement for asymmetric DL sTRP and UL mTRP scenarios |
Google |
| R1-2502953 |
Summary #1 on Rel-19 asymmetric DL sTRP/UL mTRP |
Moderator (OPPO) |
| R1-2502954 |
Summary #2 on Rel-19 asymmetric DL sTRP/UL mTRP |
Moderator (OPPO) |
| R1-2502955 |
Summary #3 on Rel-19 asymmetric DL sTRP/UL mTRP |
Moderator (OPPO) |
| R1-2502956 |
Draft Reply to RAN4 LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
Moderator (OPPO) |
| R1-2503091 |
Reply to RAN4 LS on DL timing reference to support two TA enhancement for asymmetric DL sTRP/ UL mTRP |
RAN1, OPPO |
| 9.3 |
Evolution of NR duplex operation: Sub-band full duplex (SBFD) (NR_duplex_evo) |
|
| R1-2502245 |
Higher layer parameters for Rel-19 SBFD |
Huawei, HiSilicon |
| 9.3.1 |
SBFD TX/RX/measurement procedures |
|
| R1-2501738 |
Discussion on SBFD TX/RX/measurement procedures |
MediaTek Inc |
| R1-2501752 |
Discussion on SBFD TX/RX/measurement procedures |
LG Electronics |
| R1-2501803 |
Discussion on Rel-19 SBFD operation |
vivo |
| R1-2501843 |
Discussion on SBFD TX/RX/measurement procedures |
TCL |
| R1-2501865 |
Discussion on SBFD TX/RX/measurement procedures |
Spreadtrum, UNISOC |
| R1-2501907 |
Discussion on transmission, reception and measurement procedures for SBFD operation |
ZTE Corporation, Sanechips |
| R1-2501928 |
On SBFD TX_RX_measurement procedures |
InterDigital, Inc. |
| R1-2501989 |
Discussion on SBFD TX/RX/measurement procedures |
CATT |
| R1-2502013 |
Discussion for SBFD TX/RX/ measurement procedures |
Tejas Network Limited |
| R1-2502020 |
Discussion on SBFD TX/RX/measurement procedures |
China Telecom |
| R1-2502040 |
Discussion on SBFD TX/RX/measurement procedures |
Ofinno |
| R1-2502121 |
Discussion on SBFD Tx/Rx/measurement procedures |
Fujitsu |
| R1-2502157 |
Discussion on SBFD TX/RX/measurement procedures |
CMCC |
| R1-2502197 |
Discussion on subband non-overlapping full duplex Tx-Rx and measurement operations |
NEC |
| R1-2502241 |
On subband full duplex design |
Huawei, HiSilicon |
| R1-2502277 |
Discussion on SBFD Tx/Rx/measurement procedures |
OPPO |
| R1-2502315 |
SBFD procedures |
Sony |
| R1-2502365 |
SBFD operation and procedures |
Samsung |
| R1-2502402 |
Discussion on SBFD TX/RX/measurement procedures |
Panasonic |
| R1-2502405 |
On SBFD TX/RX/measurement procedures |
Nokia, Nokia Shanghai Bell |
| R1-2502420 |
SBFD TX/RX/measurement procedures |
Ericsson |
| R1-2502438 |
Discussion on reception and transmission procedure for SBFD operation |
Xiaomi |
| R1-2502497 |
Discussion on SBFD Tx/Rx/measurement procedures |
Fraunhofer HHI, Fraunhofer IIS |
| R1-2502508 |
Discussion on SBFD TX/RX/measurement procedures |
ETRI |
| R1-2502540 |
Discussion on SBFD operation |
Transsion Holdings |
| R1-2502602 |
Discussion on SBFD TX/RX/measurement procedures |
Apple |
| R1-2502652 |
Discussion on SBFD Tx/Rx/measurement procedures |
Charter Communications, Inc |
| R1-2502656 |
SBFD Tx/Rx/measurement aspects |
Sharp |
| R1-2502668 |
Discussion on SBFD TX/RX/measurement procedures |
Kookmin University |
| R1-2502680 |
Partial PRG handling for SBFD |
ASUSTeK |
| R1-2502689 |
Discussion on SBFD TX/RX/measurement procedures |
HONOR |
| R1-2502763 |
Discussion on SBFD TX/RX/measurement procedures |
NTT DOCOMO, INC. |
| R1-2502794 |
Discussion on SBFD TX/RX/measurement procedures |
ITRI |
| R1-2502798 |
Summary #1 of SBFD TX/RX/measurement procedures |
Moderator (Xiaomi) |
| R1-2502799 |
Summary #2 of SBFD TX/RX/measurement procedures |
Moderator (Xiaomi) |
| R1-2502836 |
SBFD Transmission, Reception and Measurement Procedures |
Qualcomm Incorporated |
| R1-2502901 |
Discussion on SBFD TX/RX/measurement procedures |
Google Korea LLC |
| R1-2502913 |
Discussion on SBFD TX/RX/measurement procedures |
CEWiT |
| R1-2502925 |
Discussion on SBFD TX/RX/measurement procedures |
WILUS Inc. |
| 9.3.2 |
SBFD random access operation |
|
| R1-2501739 |
Discussion on SBFD Random Access Operation |
MediaTek Inc |
| R1-2501753 |
Discussion on SBFD random access operation |
LG Electronics |
| R1-2501804 |
Discussion on random access for Rel-19 SBFD |
vivo |
| R1-2501844 |
Discussion on SBFD random access operation |
TCL |
| R1-2501866 |
Discussion on SBFD random access operation |
Spreadtrum, UNISOC |
| R1-2501908 |
Discussion on SBFD random access operation |
ZTE Corporation, Sanechips |
| R1-2501929 |
On SBFD random access operation |
InterDigital, Inc. |
| R1-2501990 |
Discussion on SBFD random access operation |
CATT |
| R1-2502014 |
Discussion on SBFD Random Access Operation |
Tejas Network Limited |
| R1-2502021 |
Discussion on SBFD random access operation |
China Telecom |
| R1-2502041 |
Discussion on SBFD random access operation |
Ofinno |
| R1-2502085 |
Discussion on random access for SBFD |
NEC |
| R1-2502122 |
Discussion on SBFD random access operation |
Fujitsu |
| R1-2502158 |
Discussion on SBFD random access operation |
CMCC |
| R1-2502242 |
On subband full duplex random access operation |
Huawei, HiSilicon |
| R1-2502278 |
Discussion on SBFD random access operation |
OPPO |
| R1-2502316 |
SBFD RACH operations |
Sony |
| R1-2502366 |
Random access on SBFD resources |
Samsung |
| R1-2502404 |
Discussion on SBFD random access operation |
Panasonic |
| R1-2502406 |
SBFD random access operation |
Nokia, Nokia Shanghai Bell |
| R1-2502421 |
SBFD Random access operation |
Ericsson |
| R1-2502439 |
Discussion on SBFD random access operation |
Xiaomi |
| R1-2502494 |
Discussion on SBFD random access operation |
Korea Testing Laboratory |
| R1-2502509 |
SBFD random access operation |
ETRI |
| R1-2502541 |
Discussion on SBFD random access operation |
Transsion Holdings |
| R1-2502557 |
On SBFD random access operation |
Google Korea LLC |
| R1-2502568 |
SBFD random access operation |
Lenovo |
| R1-2502577 |
Discussion on SBFD random access remaining aspects |
Fainity Innovation |
| R1-2502603 |
Views on SBFD random access operation |
Apple |
| R1-2502657 |
SBFD random access aspects |
Sharp |
| R1-2502669 |
Discussion on SBFD random access operation |
Kookmin University |
| R1-2502764 |
Discussion on SBFD random access operation |
NTT DOCOMO, INC. |
| R1-2502795 |
Discussion on SBFD random access operation |
ITRI |
| R1-2502837 |
SBFD Random Access Operation |
Qualcomm Incorporated |
| R1-2502926 |
Discussion on SBFD random access operation |
WILUS Inc. |
| R1-2503016 |
Summary#1 on SBFD random access operation |
Moderator (CMCC) |
| R1-2503017 |
Summary#2 on SBFD random access operation |
Moderator (CMCC) |
| R1-2503018 |
Summary#3 on SBFD random access operation |
Moderator (CMCC) |
| 9.3.3 |
CLI handling |
|
| R1-2501740 |
Discussion on CLI Handling in SBFD System |
MediaTek Inc |
| R1-2501754 |
Discussion on CLI handling |
LG Electronics |
| R1-2501805 |
Discussion on CLI handling for Rel-19 NR duplex |
vivo |
| R1-2501867 |
Discussion on CLI handling |
Spreadtrum, UNISOC |
| R1-2501909 |
Discussion on CLI handling for Rel-19 duplex operation |
ZTE Corporation, Sanechips |
| R1-2501930 |
On CLI handling for SBFD operation |
InterDigital, Inc. |
| R1-2501991 |
Discussion on CLI handling for NR duplex evolution |
CATT |
| R1-2502015 |
Discussion on gNB-gNB CLI handling |
Tejas Network Limited |
| R1-2502086 |
CLI handling for NR duplex operations |
NEC |
| R1-2502159 |
Discussion on CLI handling |
CMCC |
| R1-2502243 |
On cross-link interference handling for subband full duplex |
Huawei, HiSilicon |
| R1-2502279 |
CLI handling in NR duplex operation |
OPPO |
| R1-2502317 |
SBFD CLI handling |
Sony |
| R1-2502367 |
Cross-link interference handling for SBFD |
Samsung |
| R1-2502407 |
Cross-link interference handling for duplex evolution |
Nokia, Nokia Shanghai Bell |
| R1-2502410 |
Discussion on CLI handling |
Panasonic |
| R1-2502422 |
CLI handling |
Ericsson |
| R1-2502440 |
Discussion on CLI handling for SBFD operation |
Xiaomi |
| R1-2502510 |
Discussion on CLI handling for SBFD operation |
ETRI |
| R1-2502558 |
On the gNB-to-gNB CLI and the UE-to-UE CLI handling |
Google Korea LLC |
| R1-2502604 |
Discussion on CLI handling |
Apple |
| R1-2502650 |
Cross-link interference (CLI) handling |
Sharp |
| R1-2502765 |
Discussion on CLI handling |
NTT DOCOMO, INC. |
| R1-2502838 |
Enhancements for CLI handling |
Qualcomm Incorporated |
| R1-2502914 |
Discussion on CLI Handling |
CEWiT |
| R1-2502958 |
Discussion on CLI handling |
NTT DOCOMO, INC. |
| R1-2503035 |
Summary #1 of CLI handling |
Moderator (Huawei) |
| R1-2503036 |
Summary #2 of CLI handling |
Moderator (Huawei) |
| R1-2503089 |
LS on impact on transmit signal quality/MPR requirement |
RAN1, Huawei |
| R1-2503090 |
Reply LS on L1 measurement |
RAN1, Huawei |
| 9.4 |
Solutions for Ambient IoT (Internet of Things) in NR (Ambient_IoT_solutions) |
|
| R1-2501957 |
Discussion on timing acquisition and synchronisation for Ambient IoT |
Lekha Wireless Solutions |
| R1-2502662 |
Skeleton for TS 38.291: “Ambient IoT Physical layer” v0.0.1 |
Huawei |
| R1-2503112 |
Session notes for 9.4 (Solutions for Ambient IoT in NR) |
Ad-Hoc Chair (Huawei) |
| 9.4.1 |
Physical channels design – modulation aspects |
|
| R1-2501706 |
Discussion on modulation aspects for A-IoT physical channel |
FUTUREWEI |
| R1-2501719 |
Modulation aspects for Ambient IoT |
Ericsson |
| R1-2501733 |
Discussion on general aspects of physical layer design for Ambient IoT |
TCL |
| R1-2501760 |
Discussion on Ambient IoT modulation |
ZTE Corporation, Sanechips |
| R1-2501776 |
AIoT Physical channels design - modulation aspects |
Nokia |
| R1-2501806 |
Discussion on Modulation Aspects of Physical Channels Design |
vivo |
| R1-2501868 |
Discussion on modulation aspects of physical channels design for Ambient IoT |
Spreadtrum, UNISOC |
| R1-2501992 |
Ambient IoT physical channel design and modulation |
CATT |
| R1-2502016 |
Discussion on modulation aspects for A-IoT physical channel |
Tejas Network Limited |
| R1-2502022 |
Discussion on physical channels design about modulation aspects for Ambient IoT |
China Telecom |
| R1-2502068 |
Discussion on modulation aspects of ambient IoT |
NEC |
| R1-2502123 |
Modulation for R2D and D2R |
Fujitsu |
| R1-2502160 |
Discussion on modulation aspects of physical channel design |
CMCC |
| R1-2502233 |
Physical channels design on modulation |
Huawei, HiSilicon |
| R1-2502273 |
Discussion on modulation aspects of A-IoT |
OPPO |
| R1-2502318 |
Physical channel design aspects for Ambient IoT |
Sony |
| R1-2502368 |
Views on Physical channels design – modulation aspects |
Samsung |
| R1-2502441 |
Discussion on modulation aspects for Ambient IoT |
Xiaomi |
| R1-2502467 |
A-IoT Physical Channels Design on Modulation Aspects |
Panasonic |
| R1-2502474 |
A-IoT PHY layer design - waveform and modulation aspects |
LG Electronics |
| R1-2502584 |
Discussion on modulation aspects of physical channel design for Ambient IoT |
InterDigital Finland Oy |
| R1-2502586 |
Discussion on Physical Channel Modulation Aspects for Ambient-IoT |
EURECOM |
| R1-2502605 |
On modulation aspects for Ambient IoT |
Apple |
| R1-2502671 |
Discussion on modulation aspects |
Sharp |
| R1-2502690 |
Discussion on Physical channels design for Ambient IoT-modulation aspects |
HONOR |
| R1-2502704 |
A-IoT - PHY modulation aspects |
MediaTek Inc. |
| R1-2502766 |
Discussion on modulation aspects of physical channel design for Ambient IoT |
NTT DOCOMO, INC. |
| R1-2502839 |
Physical channels design – modulation aspects |
Qualcomm Incorporated |
| R1-2502898 |
Discussion on modulation aspects for Ambient-IOT |
Fraunhofer IIS, Fraunhofer HHI |
| R1-2502905 |
Discussion on modulation aspects for Ambient IoT physical channels |
Lenovo |
| R1-2502927 |
Discussion on modulation aspects of physical channels design for Ambient IoT |
WILUS Inc. |
| R1-2502938 |
Discussion on modulation related aspects of AIoT |
IIT Kanpur |
| R1-2502992 |
FL summary #1 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” |
Moderator (Huawei) |
| R1-2502993 |
FL summary #2 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” |
Moderator (Huawei) |
| R1-2502994 |
FL summary #3 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” |
Moderator (Huawei) |
| R1-2503109 |
FL summary #4 for Ambient IoT: “9.4.1 Physical channels design – modulation aspects” |
Moderator (Huawei) |
| 9.4.2 |
Physical channels design – line coding, FEC, CRC, repetition aspects |
|
| R1-2501707 |
Discussion on coding aspects for A-IoT physical channel |
FUTUREWEI |
| R1-2501720 |
Coding aspects for Ambient IoT |
Ericsson |
| R1-2501734 |
Discussion on other aspects for Ambient IoT physical design |
TCL |
| R1-2501761 |
Discussion on Ambient IoTcoding |
ZTE Corporation, Sanechips |
| R1-2501777 |
AIoT Physical channels design - line coding, FEC, CRC, repetition aspects |
Nokia |
| R1-2501807 |
Discussion on line coding, FEC, CRC and repetition for A-IoT |
vivo |
| R1-2501869 |
Discussion on line coding, FEC, CRC, repetition aspects for Ambient IoT |
Spreadtrum, UNISOC |
| R1-2501993 |
Ambient IoT channel coding and small frequency shift |
CATT |
| R1-2502023 |
Discussion on physical channels design about line coding, FEC, CRC, repetition aspects for Ambient IoT |
China Telecom |
| R1-2502069 |
Physical layer design – line coding, FEC, CRC, repetition aspects |
NEC |
| R1-2502124 |
Discussion on coding aspects |
Fujitsu |
| R1-2502161 |
Discussion on coding aspects of physical channel design |
CMCC |
| R1-2502204 |
Discussion on Physical Channel Designs for A-IoT |
Panasonic |
| R1-2502234 |
Physical channel design on channel coding |
Huawei, HiSilicon |
| R1-2502274 |
Discussion on physical channels design for A-IoT |
OPPO |
| R1-2502369 |
Views on Physical channels design – line coding, FEC, CRC, repetition aspects |
Samsung |
| R1-2502442 |
Discussion on line coding, FEC, CRC and repetition aspects for Ambient IoT |
Xiaomi |
| R1-2502475 |
A-IoT PHY layer design - line coding, FEC, CRC and repetition aspects |
LG Electronics |
| R1-2502583 |
Discussion on coding aspects of physical channel design for Ambient IoT |
InterDigital Finland Oy |
| R1-2502606 |
On coding aspects for Ambient IoT |
Apple |
| R1-2502672 |
Discussion on coding aspects |
Sharp |
| R1-2502691 |
Discussion on Physical channels design for Ambient IoT-other aspects |
HONOR |
| R1-2502705 |
A-IoT - PHY line coding, FEC, CRC, repetition aspects |
MediaTek Inc. |
| R1-2502752 |
Discussion on A-IoT Physical channels design |
ASUSTeK |
| R1-2502767 |
Discussion on coding and CRC aspects of physical channel design for Ambient IoT |
NTT DOCOMO, INC. |
| R1-2502840 |
Physical channels design – line coding, FEC, CRC, repetition aspects |
Qualcomm Incorporated |
| R1-2502906 |
Discussion on the Ambient IoT physical layer design aspects for Line coding, FEC, CRC, Repetition |
Lenovo |
| R1-2502930 |
Coding aspects for Ambient IoT |
ITL |
| R1-2502939 |
Discussion on other aspects of Phy design for AIoT |
IIT Kanpur |
| R1-2503020 |
Summary #1 for coding aspects of physical channel design |
Moderator (CMCC) |
| R1-2503021 |
Summary #2 for coding aspects of physical channel design |
Moderator (CMCC) |
| R1-2503022 |
Summary #3 for coding aspects of physical channel design |
Moderator (CMCC) |
| R1-2503023 |
Summary #4 for coding aspects of physical channel design |
Moderator (CMCC) |
| R1-2503106 |
Summary #5 for coding aspects of physical channel design |
Moderator (CMCC) |
| R1-2503107 |
Summary #6 for coding aspects of physical channel design |
Moderator (CMCC) |
| 9.4.3 |
Timing acquisition and synchronization |
|
| R1-2501708 |
Discussion on timing acquisition and synchronization aspects for A-IoT |
FUTUREWEI |
| R1-2501721 |
Timing acquisition and synchronization for Ambient IoT |
Ericsson |
| R1-2501735 |
Discussion on timing acquisition and synchronization functionalities for Ambient IoT |
TCL |
| R1-2501762 |
Discussion on Ambient IoT signals |
ZTE Corporation, Sanechips |
| R1-2501778 |
AIoT Timing acquisition and synchronization |
Nokia |
| R1-2501808 |
Discussion on Timing acquisition and synchronization for AIoT |
vivo |
| R1-2501870 |
Discussion on timing acquisition and synchronization for Ambient IoT |
Spreadtrum, UNISOC |
| R1-2501895 |
Discussion on timing acquisition and synchronization for Ambient IoT |
Lenovo |
| R1-2501921 |
Discussion on timing acquisition and synchronization |
InterDigital, Inc. |
| R1-2501994 |
Ambient IoT Timing and synchronization |
CATT |
| R1-2502024 |
Discussion on timing acquisition and synchronization for Ambient IoT |
China Telecom |
| R1-2502042 |
Views on Timing acquisition and synchronization |
Ofinno |
| R1-2502125 |
Discussion on timing acquisition and synchronization |
Fujitsu |
| R1-2502162 |
Discussion on timing acquisition and synchronization |
CMCC |
| R1-2502202 |
Discussion on timing acquisition and synchronization |
NEC |
| R1-2502235 |
Physical signals design |
Huawei, HiSilicon |
| R1-2502275 |
Discussion on timing acquisition and synchronization for A-IoT |
OPPO |
| R1-2502319 |
Timing acquisition and synchronisation for Ambient IoT |
Sony |
| R1-2502370 |
Views on timing acquisition and synchronization |
Samsung |
| R1-2502443 |
Discussion on timing acquisition and synchronization for Ambient IoT |
Xiaomi |
| R1-2502468 |
A-IoT Timing Acquisition and Synchronization |
Panasonic |
| R1-2502471 |
Discussion on timing acquisition and synchronisation for Ambient IoT |
Lekha Wireless Solutions |
| R1-2502476 |
Timing acquisition and synchronization for A-IoT |
LG Electronics |
| R1-2502511 |
Discussion on timing acquisition and synchronization |
ETRI |
| R1-2502607 |
On timing acquisition & synchronization aspects for Ambient IoT |
Apple |
| R1-2502609 |
FL Summary#1 on timing acquisition and synchronization for Ambient IoT |
Moderator (Apple) |
| R1-2502610 |
FL Summary#2 on timing acquisition and synchronization for Ambient IoT |
Moderator (Apple) |
| R1-2502611 |
FL Summary#3 on timing acquisition and synchronization for Ambient IoT |
Moderator (Apple) |
| R1-2502664 |
Discussion on timing and synchronization aspects |
Fraunhofer HHI, Fraunhofer IIS |
| R1-2502673 |
Discussion on timing acquisition and synchronization |
Sharp |
| R1-2502706 |
A-IoT - Timing acquisition and synchronization |
MediaTek Inc. |
| R1-2502768 |
Discussion on timing acquisition and synchronization for Ambient IoT |
NTT DOCOMO, INC. |
| R1-2502841 |
Timing acquisition and synchronization |
Qualcomm Incorporated |
| R1-2502896 |
Timing acquisition and synchronization aspects for Ambient-IOT |
Fraunhofer IIS, Fraunhofer HHI |
| R1-2502915 |
Discussion on timing acquisition and synchronization aspects for Ambient IoT |
CEWiT |
| R1-2502940 |
Discussion on timing and synchronization aspects for AIoT |
IIT Kanpur |
| R1-2503123 |
Final summary on timing acquisition and synchronization for Ambient IoT |
Moderator (Apple) |
| 9.4.4 |
Other aspects incl. multiplexing/multiple access, scheduling information, and timing relationships |
|
| R1-2501709 |
Discussion on multiple access, scheduling and timing aspects for A-IoT |
FUTUREWEI |
| R1-2501722 |
Other aspects for Ambient IoT |
Ericsson |
| R1-2501763 |
Discussion on Ambient IoT multiple access and timing |
ZTE Corporation, Sanechips |
| R1-2501779 |
AIoT Other aspects incl. multiplexing/multiple access, scheduling information, and timing relationships |
Nokia |
| R1-2501809 |
Discussion on other aspects for Rel-19 Ambient IoT |
vivo |
| R1-2501871 |
Discussion on other aspects for Ambient IoT |
Spreadtrum, UNISOC |
| R1-2501896 |
Discussion on multiple access, scheduling and timing aspects of Ambient IoT |
Lenovo |
| R1-2501922 |
Discussion on multiplexing/multiple access, scheduling information, and timing relationships |
InterDigital, Inc. |
| R1-2501995 |
Ambient IoT frame structure, system control and resource allocation |
CATT |
| R1-2502017 |
Discussion on multiple access, scheduling and timing aspects for A-IoT |
Tejas Network Limited |
| R1-2502025 |
Discussion on other aspects for Ambient IoT |
China Telecom |
| R1-2502043 |
Views on other aspects for AIoT |
Ofinno |
| R1-2502070 |
Discussion on control and other aspects of ambient IoT |
NEC |
| R1-2502126 |
Discussion on other aspects of Ambient IoT |
Fujitsu |
| R1-2502163 |
Discussion on access, scheduling and timing relationships |
CMCC |
| R1-2502205 |
Discussion on other aspects of A-IoT |
Panasonic |
| R1-2502236 |
Multiplexing, scheduling, and other physical-layer procedures |
Huawei, HiSilicon |
| R1-2502276 |
Discussions on other aspects of A-IoT communication |
OPPO |
| R1-2502320 |
Multiplexing, multiple access and timing relationships for Ambient IoT |
Sony |
| R1-2502371 |
Views on aspects including multiplexing/multiple access, scheduling information, and timing relationships |
Samsung |
| R1-2502444 |
Discussion on other aspects for Ambient IoT |
Xiaomi |
| R1-2502477 |
Other aspects for A-IoT |
LG Electronics |
| R1-2502498 |
FL summary #1 on other aspects for Rel-19 Ambient IoT |
Moderator (vivo) |
| R1-2502499 |
FL summary #2 on other aspects for Rel-19 Ambient IoT |
Moderator (vivo) |
| R1-2502500 |
FL summary #3 on other aspects for Rel-19 Ambient IoT |
Moderator (vivo) |
| R1-2502512 |
Discussion on other aspects for Ambient IoT |
ETRI |
| R1-2502608 |
On multiple access, scheduling and control for Ambient IoT |
Apple |
| R1-2502674 |
Discussion on other aspects |
Sharp |
| R1-2502692 |
Discuss on L1 control information and L1 procedural aspects |
HONOR |
| R1-2502699 |
Discussion on multiple access, scheduling information and timing relationships for Ambient IoT |
TCL |
| R1-2502707 |
A-IoT - Other aspects |
MediaTek Inc. |
| R1-2502729 |
Discussion on other aspects of Ambient IoT |
KT Corp. |
| R1-2502753 |
Discussion on control information and procedural aspects |
ASUSTeK |
| R1-2502769 |
Discussion on other aspects for Ambient IoT |
NTT DOCOMO, INC. |
| R1-2502842 |
Discussion on other aspects for Rel-19 Ambient IoT |
Qualcomm Incorporated |
| R1-2502890 |
Discussion on multiplexing, multiple access, scheduling information, and timing relationships |
Google |
| R1-2502916 |
Discussion on multiple access, scheduling and timing aspects for Ambient IoT |
CEWiT |
| R1-2502928 |
Discussion on multiplexing/multiple access and timing relationships for Ambient IoT |
WILUS Inc. |
| R1-2502941 |
Discussion on other aspects of AIoT |
IIT Kanpur |
| R1-2503104 |
FL summary #4 on other aspects for Rel-19 Ambient IoT |
Moderator (vivo) |
| 9.5 |
Enhancements of network energy savings for NR (Netw_Energy_NR_enh) |
|
| R1-2502801 |
Update of RAN1 RRC parameter list for R19 NES WI |
Rapporteur(Ericsson) |
| R1-2503126 |
Updated list of RAN1 agreements for Rel-19 NES WI |
Rapporteur (Ericsson) |
| R1-2503145 |
Summary of the discussion on RAN1 RRC parameter list for R19 NES |
Rapporteur (Ericsson) |
| 9.5.1 |
On-demand SSB SCell operation |
|
| R1-2501713 |
Discussion of on-demand SSB Scell operation |
FUTUREWEI |
| R1-2501736 |
On-demand SSB Scell operation for NES |
TCL |
| R1-2501764 |
Discussion on on-demond SSB for NES |
ZTE Corporation, Sanechips |
| R1-2501772 |
On-demand SSB SCell Operation |
Nokia, Nokia Shanghai Bell |
| R1-2501810 |
Discussions on on-demand SSB Scell operation |
vivo |
| R1-2501872 |
Discussion on on-demand SSB SCell operation |
Spreadtrum, UNISOC |
| R1-2501952 |
On-demand SSB SCell Operation |
Google |
| R1-2501996 |
Discussion on on-demand SSB SCell operation |
CATT |
| R1-2502010 |
OD-SSB for SCELL |
Tejas Network Limited |
| R1-2502026 |
Discussion on on-demand SSB operation for SCell |
China Telecom |
| R1-2502044 |
Discussion on on-demand SSB SCell operation |
Ofinno |
| R1-2502092 |
Discussion on on-demand SSB SCell operation |
KT Corp. |
| R1-2502127 |
Discussion on on-demand SSB SCell operation |
Fujitsu |
| R1-2502164 |
Discussion on on-demand SSB SCell operation |
CMCC |
| R1-2502198 |
Discussion on on-demand SSB for SCell operation |
NEC |
| R1-2502229 |
On-demand SSB SCell operation for eNES |
Huawei, HiSilicon |
| R1-2502261 |
Discussion on the enhancement to support on demand SSB SCell operation |
OPPO |
| R1-2502334 |
Discussion on on-demand SSB SCell operation |
InterDigital, Inc. |
| R1-2502372 |
On-demand SSB SCell operation |
Samsung |
| R1-2502403 |
Discussion on remaining details of on-demand SSB operation on SCell |
Sharp |
| R1-2502445 |
Discussion on on-demand SSB SCell operation |
Xiaomi |
| R1-2502478 |
On-demand SSB SCell operation |
LG Electronics |
| R1-2502513 |
Discussion on On-demand SSB SCell operation |
ETRI |
| R1-2502542 |
Discussion on On-Demand SSB SCell operation |
Transsion Holdings |
| R1-2502569 |
On-demand SSB SCell operation |
Lenovo |
| R1-2502578 |
Discussion on on-demand SSB SCell operation |
Panasonic |
| R1-2502612 |
On-demand SSB SCell Operation |
Apple |
| R1-2502679 |
DCI based signaling for on-demand SSB |
ASUSTeK |
| R1-2502708 |
On-demand SSB SCell operation |
MediaTek Inc. |
| R1-2502770 |
Discussion on on-demand SSB SCell operation |
NTT DOCOMO, INC. |
| R1-2502796 |
Discussion on on-demand SSB SCell operation |
ITRI |
| R1-2502802 |
On-demand SSB SCell operation |
Ericsson |
| R1-2502843 |
On-demand SSB operation for Scell |
Qualcomm Incorporated |
| R1-2502917 |
Discussion on on-demand SSB Scell operation |
CEWiT |
| R1-2503045 |
Summary #1 of on-demand SSB for NES |
Moderator (LG Electronics) |
| R1-2503046 |
Summary #2 of on-demand SSB for NES |
Moderator (LG Electronics) |
| R1-2503047 |
Summary #3 of on-demand SSB for NES |
Moderator (LG Electronics) |
| R1-2503048 |
Summary #4 of on-demand SSB for NES |
Moderator (LG Electronics) |
| R1-2503096 |
DRAFT LS to RAN4 on time instance B for on-demand SSB SCell operation |
LG Electronics |
| R1-2503108 |
LS to RAN4 on time instance B for on-demand SSB SCell operation |
RAN1, LG Electronics |
| R1-2503119 |
Summary #5 of on-demand SSB for NES |
Moderator (LG Electronics) |
| 9.5.2 |
On-demand SIB1 for idle/inactive mode UEs |
|
| R1-2501714 |
Discussion of on-demand SIB1 for idle/inactive mode UEs |
FUTUREWEI |
| R1-2501765 |
Discussion on on-demand SIB1 for NES |
ZTE Corporation, Sanechips |
| R1-2501773 |
On-demand SIB1 for Idle/Inactive mode UEs |
Nokia, Nokia Shanghai Bell |
| R1-2501811 |
Discussions on on-demand SIB1 for idle/inactive mode UEs |
vivo |
| R1-2501873 |
Discussion on on-demand SIB1 for idle/inactive mode UEs |
Spreadtrum, UNISOC |
| R1-2501953 |
On-demand SIB1 for Idle/Inactive Mode UE |
Google |
| R1-2501997 |
Discussion on on-demand SIB1 |
CATT |
| R1-2502027 |
Discussion on on-demand SIB1 for idle/inactive mode UEs |
China Telecom |
| R1-2502045 |
Discussion on on-demand SIB1 for idle/inactive mode UEs |
Ofinno |
| R1-2502128 |
Discussion on on-demand SIB1 transmission for network energy savings |
Fujitsu |
| R1-2502165 |
Discussion on on-demand SIB1 for UEs in idle/inactive mode |
CMCC |
| R1-2502199 |
Discussion on on-demand SIB1 for UEs in idle/inactive mode |
NEC |
| R1-2502230 |
Discussion on on-demand SIB1 for eNES |
Huawei, HiSilicon |
| R1-2502262 |
Discussion on the enhancement to support on demand SIB1 for idle/inactive mode UE |
OPPO |
| R1-2502321 |
On-demand SIB1 for idle/inactive mode UEs |
Sony |
| R1-2502335 |
Discussion on on-demand SIB1 for idle/inactive mode UEs |
InterDigital, Inc. |
| R1-2502373 |
On-demand SIB1 for idle/inactive mode UEs |
Samsung |
| R1-2502446 |
Discussion on on-demand SIB1 for idle/inactive mode UEs |
Xiaomi |
| R1-2502469 |
OD-SIB1 for Idle/Inactive UEs |
Tejas Network Limited |
| R1-2502479 |
On-demand SIB1 for idle/inactive mode UEs |
LG Electronics |
| R1-2502514 |
On-demand SIB1 for idle/inactive mode UEs |
ETRI |
| R1-2502543 |
Discussion on on-demand SIB1 transmission for idle/inactive mode UEs |
Transsion Holdings |
| R1-2502570 |
On-demand SIB1 for idle/inactive mode UEs |
Lenovo |
| R1-2502579 |
Discussion on on-demand SIB1 for idle/inactive mode UEs |
Panasonic |
| R1-2502613 |
On On-demand SIB1 for IDLE/INACTIVE mode UEs |
Apple |
| R1-2502658 |
On-demand SIB1 for NES |
Fraunhofer IIS, Fraunhofer HHI |
| R1-2502678 |
Remaining details for OD-SIB1 request |
ASUSTeK |
| R1-2502681 |
Discussion on on-demand SIB1 transmission for idle UEs |
Sharp |
| R1-2502709 |
On-demand SIB1 for idle or inactive mode UEs |
MediaTek Inc. |
| R1-2502750 |
Discussion on on-demand SIB1 for idle/inactive mode UEs |
DENSO CORPORATION |
| R1-2502771 |
Discussion on on-demand SIB1 for idle/inactive mode UEs |
NTT DOCOMO, INC. |
| R1-2502803 |
On-demand SIB1 for UEs in idle/inactive mode for NES |
Ericsson |
| R1-2502844 |
On-demand SIB1 procedure |
Qualcomm Incorporated |
| R1-2502918 |
Discussion on on-demand SIB1 |
CEWiT |
| R1-2502921 |
Discussion on on-demand SIB1 in idle/inactive mode |
CAICT |
| R1-2503004 |
FL summary 1 for on-demand SIB1 in idle/inactive mode |
Moderator (MediaTek) |
| R1-2503005 |
FL summary 2 for on-demand SIB1 in idle/inactive mode |
Moderator (MediaTek) |
| R1-2503006 |
FL summary 3 for on-demand SIB1 in idle/inactive mode |
Moderator (MediaTek) |
| R1-2503007 |
FL summary 4 for on-demand SIB1 in idle/inactive mode |
Moderator (MediaTek) |
| R1-2503008 |
FL summary 5 for on-demand SIB1 in idle/inactive mode |
Moderator (MediaTek) |
| 9.5.3 |
Adaptation of common signal/channel transmissions |
|
| R1-2501715 |
Discussion of the adaptation of common signal/channel transmissions |
FUTUREWEI |
| R1-2501766 |
Discussion on common signal channel for NES |
ZTE Corporation, Sanechips |
| R1-2501774 |
Adaptation of common signal/channel transmissions |
Nokia, Nokia Shanghai Bell |
| R1-2501812 |
Discussions on adaptation of common signal/channel transmissions |
vivo |
| R1-2501874 |
Discussion on adaptation of common signal/channel transmissions |
Spreadtrum, UNISOC |
| R1-2501954 |
Adaptation of Common Signals |
Google |
| R1-2501998 |
Discussion on adaptation of common signal/channel transmissions |
CATT |
| R1-2502028 |
Discussion on common signal/channel adaptation |
China Telecom |
| R1-2502093 |
Discussion on adaptation of common signal/channel transmissions |
KT Corp. |
| R1-2502129 |
Discussion on adaptation of common signal channel transmissions |
Fujitsu |
| R1-2502166 |
Discussion on adaptation of common signal/channel transmissions |
CMCC |
| R1-2502192 |
Discussion on adaptation of common signal/channel transmission |
Panasonic |
| R1-2502200 |
Discussion on adaptation of common signal/channel transmissions |
NEC |
| R1-2502231 |
On common channel/signal adaptation for eNES |
Huawei, HiSilicon |
| R1-2502254 |
Adaptation of common signals and channels |
Lenovo |
| R1-2502263 |
Discussion on adaptation of common signal/channel transmission |
OPPO |
| R1-2502336 |
Discussion on adaptation of common signal/channel transmissions |
InterDigital, Inc. |
| R1-2502374 |
Adaptation of common signal/channel transmissions |
Samsung |
| R1-2502447 |
Discussion on adaptation of common signal and channel transmissions |
Xiaomi |
| R1-2502470 |
Adaptation of common signal/channels |
Tejas Network Limited |
| R1-2502480 |
Adaptation of common signal/channel transmissions |
LG Electronics |
| R1-2502515 |
Adaptation of common signal/channel transmissions |
ETRI |
| R1-2502544 |
Discussion on adaptive transmission of common signal or common channel |
Transsion Holdings |
| R1-2502614 |
On adaptation of common signal/channel for NES enhancements |
Apple |
| R1-2502659 |
Adaptation of Common Signals and Channels for NES |
Fraunhofer IIS, Fraunhofer HHI |
| R1-2502682 |
Discussion on adaptation of common signal/channel transmissions |
Sharp |
| R1-2502693 |
Discussion on adaptation of common signal channel transmissions |
HONOR |
| R1-2502710 |
Adaptation of common signal/channel transmissions |
MediaTek Inc. |
| R1-2502772 |
Discussion on adaptation of common signal/channel transmissions |
NTT DOCOMO, INC. |
| R1-2502797 |
Discussion on common signal adaptation |
KDDI Corporation |
| R1-2502804 |
Adaptation of common signal/channel transmissions for NES |
Ericsson |
| R1-2502845 |
Adaptation of common channel transmissions |
Qualcomm Incorporated |
| R1-2502919 |
Discussion on adaptation of common signal and channel transmissions |
CEWiT |
| R1-2503052 |
Summary#1 of AI 9.5.3 for R19 NES |
Moderator (Ericsson) |
| R1-2503053 |
Summary#2 of AI 9.5.3 for R19 NES |
Moderator (Ericsson) |
| R1-2503054 |
Summary#3 of AI 9.5.3 for R19 NES |
Moderator (Ericsson) |
| R1-2503085 |
Draft LS on DCI-based PRACH adaptation |
Moderator (Ericsson) |
| R1-2503086 |
LS on DCI-based PRACH adaptation |
RAN1, Ericsson |
| R1-2503124 |
Summary#4 of AI 9.5.3 for R19 NES |
Moderator (Ericsson) |
| R1-2503125 |
Final Summary of AI 9.5.3 for R19 NES |
Moderator (Ericsson) |
| 9.6 |
Low-power wake-up signal and receiver for NR (NR_LPWUS) |
|
| R1-2501813 |
Updated RRC parameters list for Rel-19 LP-WUS/WUR |
vivo |
| R1-2503100 |
Summary of RAN1 agreements on LP-WUS/WUR for NR |
Rapporteur (vivo) |
| R1-2503137 |
Summary of discussion on RRC parameters for Rel-19 LP-WUS/WUR |
vivo (WI rapporteur) |
| 9.6.1 |
LP-WUS and LP-SS design |
|
| R1-2501710 |
Discussion on LP-WUS and LP-SS Design |
FUTUREWEI |
| R1-2501737 |
Discussion on LP-WUS and LP-SS Design |
EURECOM |
| R1-2501767 |
Discussion on LP-WUS design |
ZTE Corporation, Sanechips |
| R1-2501814 |
Remaining issues on LP-WUS and LP-SS design |
vivo |
| R1-2501845 |
Discussion on LP-WUS and LP-SS Design |
TCL |
| R1-2501875 |
Discussion on LP-WUS and LP-SS design |
Spreadtrum, UNISOC |
| R1-2501999 |
Design of LP-WUS and LP-SS |
CATT |
| R1-2502007 |
LP-WUS and LP-SS design |
Nokia |
| R1-2502075 |
Discussion on LP-WUS and LP-SS design |
NEC |
| R1-2502167 |
Discussion on LP-WUS and LP-SS design |
CMCC |
| R1-2502237 |
Signal Design of LP-WUS and LP-SS |
Huawei, HiSilicon |
| R1-2502257 |
Signal design for LP-WUS and LP-SS |
OPPO |
| R1-2502302 |
Discussion on LP-WUS and LP-SS design |
InterDigital, Inc. |
| R1-2502322 |
LP-WUS and LP-SS design |
Sony |
| R1-2502375 |
Discussion on LP-WUS and LP-SS design |
Samsung |
| R1-2502448 |
Discussion on LP-WUS and LP-SS design |
Xiaomi |
| R1-2502481 |
Discussion on LP-WUS and LP-SS design |
LG Electronics |
| R1-2502580 |
Discussion on the LP-WUS and LP-SS design |
Panasonic |
| R1-2502615 |
LP-WUS and LP-SS design |
Apple |
| R1-2502675 |
Discussion on LP-WUS and LP-SS design |
Sharp |
| R1-2502694 |
Discussion on LP-WUS and LP-SS design |
HONOR |
| R1-2502711 |
LP-WUS and LP-SS design |
MediaTek Inc. |
| R1-2502773 |
Discussion on LP-WUS and LP-SS design |
NTT DOCOMO, INC. |
| R1-2502805 |
LP-WUS and LP-SS design |
Ericsson |
| R1-2502846 |
LP-WUS and LP-SS design |
Qualcomm Incorporated |
| R1-2502880 |
On LP-WUS and LP-SS design |
Nordic Semiconductor ASA |
| R1-2502908 |
Discussion on LP-WUS and LP-SS design |
Lenovo |
| R1-2503000 |
LP-WUS and LP-SS design |
Nokia |
| R1-2503014 |
Summary #1 of discussions on LP-WUS and LP-SS design |
Moderator (vivo) |
| R1-2503015 |
Summary #2 of discussions on LP-WUS and LP-SS design |
Moderator (vivo) |
| R1-2503082 |
Summary #3 of discussions on LP-WUS and LP-SS design |
Moderator (vivo) |
| R1-2503083 |
Summary #4 of discussions on LP-WUS and LP-SS design |
Moderator (vivo) |
| R1-2503097 |
Summary #5 of discussions on LP-WUS and LP-SS design |
Moderator (vivo) |
| R1-2503098 |
Summary #6 of discussions on LP-WUS and LP-SS design |
Moderator (vivo) |
| R1-2503099 |
Final summary of discussions on LP-WUS and LP-SS design |
Moderator (vivo) |
| 9.6.2 |
LP-WUS operation in IDLE/INACTIVE modes |
|
| R1-2501711 |
Discussion on LP-WUS Operation in IDLE/INACTIVE Modes |
FUTUREWEI |
| R1-2501768 |
Discussion on LP-WUS operation in IDLE/INACTIVE mode |
ZTE Corporation, Sanechips |
| R1-2501815 |
Remaining issues on LP-WUS operation in IDLE/INACTIVE modes |
vivo |
| R1-2501846 |
Discussion on LP-WUS Operation in IDLE/INACTIVE state |
TCL |
| R1-2501876 |
Discussion on LP-WUS operation in IDLE/INACTIVE modes |
Spreadtrum, UNISOC |
| R1-2502000 |
System design and procedure of LP-WUS operation for UE in IDLE/Inactive Modes |
CATT |
| R1-2502008 |
LP-WUS operation in IDLE/Inactive mode |
Nokia |
| R1-2502076 |
Discussion on LP-WUS operation in RRC IDLE/INACTIVE mode |
NEC |
| R1-2502168 |
Discussion on LP-WUS operation in IDLE/INACTIVE modes |
CMCC |
| R1-2502238 |
Procedures and functionalities of LP-WUS in IDLE/INACTIVE mode |
Huawei, HiSilicon |
| R1-2502258 |
Further consideration on LP-WUS operation in RRC_IDLE/INACTIVE modes |
OPPO |
| R1-2502303 |
Discussion on LP-WUS operation in IDLE/INACTIVE modes |
InterDigital, Inc. |
| R1-2502323 |
LP-WUS operation in IDLE / INACTIVE modes |
Sony |
| R1-2502376 |
Discussion on LP-WUS operation in IDLE/INACTIVE modes |
Samsung |
| R1-2502449 |
Discussion on LP-WUS operation in Idle/Inactive modes |
Xiaomi |
| R1-2502482 |
Discussion on LP-WUS operation in IDLE/INACTIVE modes |
LG Electronics |
| R1-2502516 |
Discussion on LP-WUS operation in IDLE/INACTIVE modes |
ETRI |
| R1-2502581 |
Discussion on LP-WUS operation in IDLE/INACTIVE modes |
Panasonic |
| R1-2502616 |
LP-WUS operation in IDLE/INACTIVE modes |
Apple |
| R1-2502618 |
Summary #1 on LP-WUS operation in IDLE/INACTIVE mode |
Moderator (Apple) |
| R1-2502619 |
Summary #2 on LP-WUS operation in IDLE/INACTIVE mode |
Moderator (Apple) |
| R1-2502620 |
Summary #3 on LP-WUS operation in IDLE/INACTIVE mode |
Moderator (Apple) |
| R1-2502621 |
Summary #4 on LP-WUS operation in IDLE/INACTIVE mode |
Moderator (Apple) |
| R1-2502622 |
Summary #5 on LP-WUS operation in IDLE/INACTIVE mode |
Moderator (Apple) |
| R1-2502676 |
Discussion on LP-WUS operation in IDLE/INACTIVE modes |
Sharp |
| R1-2502712 |
LP-WUS operation in IDLE/INACTIVE modes |
MediaTek Inc. |
| R1-2502774 |
Discussion on LP-WUS operation in IDLE/INACTIVE modes |
NTT DOCOMO, INC. |
| R1-2502806 |
LP-WUS operation in IDLE and INACTIVE modes |
Ericsson |
| R1-2502847 |
LP-WUR operation in idle and inactive modes |
Qualcomm Incorporated |
| R1-2502879 |
On LP-WUS operation in IDLE/Inactive |
Nordic Semiconductor ASA |
| R1-2502907 |
Discussion on LP-WUS operation in Idle/Inactive modes |
Lenovo |
| R1-2503087 |
Draft LS on the RRM measurement metrics for OFDM-based LP-WUR |
Moderator (Apple) |
| R1-2503103 |
LS on the RRM measurement metrics for OFDM-based LP-WUR |
RAN1, Apple |
| R1-2503147 |
Summary #6 on LP-WUS operation in IDLE/INACTIVE mode |
Moderator (Apple) |
| 9.6.3 |
LP-WUS operation in CONNECTED modes |
|
| R1-2501769 |
Discussion on LP-WUS operation in CONNECTED mode |
ZTE Corporation, Sanechips |
| R1-2501816 |
Remaining issues on LP-WUS operation in CONNECTED modes |
vivo |
| R1-2501877 |
Discussion on LP-WUS operation in CONNECTED modes |
Spreadtrum, UNISOC |
| R1-2502001 |
System design and procedure of LP-WUS operation for UE in CONNECTED Modes |
CATT |
| R1-2502009 |
LP-WUS operation in CONNECTED mode |
Nokia |
| R1-2502060 |
Discussion on LP-WUS operation in CONNECTED mode |
Panasonic |
| R1-2502077 |
Discussion on LP-WUS operation in RRC CONNECTED mode |
NEC |
| R1-2502169 |
Discussion on LP-WUS operation in CONNECTED mode |
CMCC |
| R1-2502239 |
Procedures and functionalities of LP-WUS in CONNECTED mode |
Huawei, HiSilicon |
| R1-2502259 |
Further consideration on LP-WUS operation in connected mode |
OPPO |
| R1-2502304 |
Discussion on RRC CONNECTED mode LP-WUS monitoring |
InterDigital, Inc. |
| R1-2502324 |
LP-WUS operation in CONNECTED mode |
Sony |
| R1-2502377 |
Discussion on LP-WUS operation in CONNECTED modes |
Samsung |
| R1-2502450 |
Discussion on LP-WUS operation in Connected mode |
Xiaomi |
| R1-2502483 |
Discussion on LP-WUS operation in CONNECTED modes |
LG Electronics |
| R1-2502517 |
Discussion on LP-WUS operation in CONNECTED modes |
ETRI |
| R1-2502576 |
Discussion on LP-WUS procedures in Connected mode |
TCL |
| R1-2502617 |
LP-WUS operation in CONNECTED modes |
Apple |
| R1-2502677 |
Discussion on LP-WUS operation in CONNECTED modes |
Sharp |
| R1-2502713 |
LP-WUS operation in CONNECTED modes |
MediaTek Inc. |
| R1-2502775 |
Discussion on LP-WUS operation in CONNECTED mode |
NTT DOCOMO, INC. |
| R1-2502807 |
LP-WUS operation in CONNECTED mode |
Ericsson |
| R1-2502848 |
LP-WUR operation in connected mode |
Qualcomm Incorporated |
| R1-2502997 |
FL summary #1 on LP-WUS operation in CONNECTED mode |
Moderator (NTT DOCOMO) |
| R1-2503055 |
FL summary #2 on LP-WUS operation in CONNECTED mode |
Moderator (NTT DOCOMO) |
| R1-2503088 |
FL summary #3 on LP-WUS operation in CONNECTED mode |
Moderator (NTT DOCOMO) |
| R1-2503102 |
FL summary #4 on LP-WUS operation in CONNECTED mode |
Moderator (NTT DOCOMO) |
| R1-2503120 |
FL summary #5 on LP-WUS operation in CONNECTED mode |
Moderator (NTT DOCOMO) |
| R1-2503121 |
Final summary on LP-WUS operation in CONNECTED mode |
Moderator (NTT DOCOMO) |
| 9.7 |
Study on channel modelling for Integrated Sensing And Communication (ISAC) for NR (FS_Sensing_NR) |
|
| R1-2502552 |
Draft CR for TR 38.901 to introduce channel model for ISAC |
Xiaomi, AT&T |
| R1-2503072 |
Draft CR for TR 38.901 to introduce channel model for ISAC |
Xiaomi, AT&T |
| R1-2503113 |
Session notes for 9.7 (Study on channel modelling for Integrated Sensing And Communication for NR) |
Ad-Hoc Chair (Huawei) |
| 9.7.1 |
ISAC deployment scenarios |
|
| R1-2501817 |
Views on Rel-19 ISAC deployment scenarios |
vivo |
| R1-2501839 |
Discussion on ISAC deployment scenarios and requirements |
EURECOM |
| R1-2501926 |
Discussion on ISAC deployment scenarios |
InterDigital, Inc. |
| R1-2501935 |
Deployment scenarios for integrated sensing and communication with NR |
NVIDIA |
| R1-2502002 |
Discussion on ISAC deployment scenarios |
CATT, CICTCI |
| R1-2502029 |
Discussion on ISAC deployment scenarios |
China Telecom |
| R1-2502051 |
Discussion on ISAC Deployment Scenarios |
Nokia, Nokia Shanghai Bell |
| R1-2502054 |
Discussion on ISAC deployment scenarios |
Tiami Networks |
| R1-2502062 |
Discussion on ISAC deployment scenarios |
ZTE Corporation, Sanechips |
| R1-2502067 |
Discussion on ISAC deployment scenarios |
Panasonic |
| R1-2502170 |
Discussion on ISAC channel model calibration |
CMCC, China Southern Power Grid |
| R1-2502207 |
Deployment scenarios for ISAC channel model |
Huawei, HiSilicon |
| R1-2502285 |
Discussion on ISAC channel model calibration |
OPPO |
| R1-2502325 |
Discussion on ISAC deployment scenarios |
Sony |
| R1-2502378 |
Discussion on ISAC deployment scenarios |
Samsung |
| R1-2502416 |
Discussion on ISAC deployment scenarios |
CALTTA |
| R1-2502418 |
Discussion on ISAC channel calibration |
BUPT, CMCC |
| R1-2502451 |
Deployment scenarios and evaluation assumptions for ISAC channel model |
Xiaomi |
| R1-2502465 |
Discussion on ISAC deployment scenarios |
TOYOTA InfoTechnology Center |
| R1-2502588 |
Discussion on ISAC deployment scenarios |
Lenovo |
| R1-2502623 |
Discussion on ISAC deployment scenarios |
Apple |
| R1-2502714 |
Discussion on ISAC deployment scenario |
MediaTek Inc. |
| R1-2502725 |
Discussion on ISAC Deployment Scenarios |
Ericsson |
| R1-2502731 |
FL Summary #1 on ISAC Scenarios and Calibrations |
Moderator (AT&T) |
| R1-2502732 |
FL Summary #2 on ISAC Scenarios and Calibrations |
Moderator (AT&T) |
| R1-2502733 |
FL Summary #3 on ISAC Scenarios and Calibrations |
Moderator (AT&T) |
| R1-2502734 |
FL Summary #4 on ISAC Scenarios and Calibrations |
Moderator (AT&T) |
| R1-2502820 |
Discussion on ISAC deployment scenarios |
LG Electronics |
| R1-2502849 |
Discussion on ISAC deployment scenarios |
Qualcomm Incorporated |
| R1-2502922 |
Considerations on ISCA deployment scenarios |
CAICT |
| 9.7.2 |
ISAC channel modelling |
|
| R1-2501818 |
Views on Rel-19 ISAC channel modelling |
vivo, BUPT |
| R1-2501840 |
Discussion on ISAC channel modeling |
EURECOM |
| R1-2501878 |
Discussion on ISAC channel modeling |
Spreadtrum, UNISOC |
| R1-2501927 |
Discussion on ISAC channel modeling |
InterDigital, Inc. |
| R1-2501933 |
Channel modelling for integrated sensing and communication with NR |
NVIDIA |
| R1-2502003 |
Discussion on ISAC channel modelling |
CATT, CICTCI |
| R1-2502030 |
Discussion on ISAC channel modelling |
China Telecom |
| R1-2502052 |
Discussion on ISAC channel modeling |
Nokia, Nokia Shanghai Bell |
| R1-2502055 |
Discussion on ISAC Channel Modeling |
Tiami Networks |
| R1-2502063 |
Joint views on mono-static background channel modeling |
ZTE Corporation, Sanechips, OPPO, BUPT, BJTU, CAICT, Xiaomi |
| R1-2502171 |
Discussion on channel modeling methodology for ISAC |
CMCC, BUPT, SEU, PML |
| R1-2502208 |
Channel modelling for ISAC |
Huawei, HiSilicon |
| R1-2502286 |
Study on ISAC channel modelling |
OPPO |
| R1-2502326 |
Discussion on Channel Modelling for ISAC |
Sony |
| R1-2502379 |
Discussion on ISAC channel modelling |
Samsung |
| R1-2502417 |
Discussion on channel modelling for ISAC |
CALTTA, ZTE Corporation, Sanechips |
| R1-2502419 |
ISAC Channel Modeling and Measurement Validation |
BUPT, CMCC, VIVO |
| R1-2502452 |
Discussion on ISAC channel model |
Xiaomi, BJTU, BUPT |
| R1-2502466 |
Discussion on ISAC channel modelling |
TOYOTA InfoTechnology Center |
| R1-2502553 |
Summary #1 on ISAC channel modelling |
Moderator (Xiaomi) |
| R1-2502554 |
Summary #2 on ISAC channel modelling |
Moderator (Xiaomi) |
| R1-2502555 |
Summary #3 on ISAC channel modelling |
Moderator (Xiaomi) |
| R1-2502556 |
Summary #4 on ISAC channel modelling |
Moderator (Xiaomi) |
| R1-2502565 |
Discussion on ISAC channel modelling |
Tejas Network Limited |
| R1-2502572 |
Discussion on ISAC Channel Modeling |
NIST |
| R1-2502587 |
Discussion on Channel Modelling for ISAC |
Lenovo |
| R1-2502624 |
Discussion on ISAC channel modelling |
Apple |
| R1-2502715 |
Discussion on ISAC channel modelling |
MediaTek Inc. |
| R1-2502726 |
Discussion on ISAC Channel Modelling |
Ericsson |
| R1-2502736 |
Discussions on ISAC Channel Modeling |
AT&T |
| R1-2502776 |
Discussion on ISAC Channel Modelling |
NTT DOCOMO, INC. |
| R1-2502814 |
Discussion on ISAC channel modelling |
Panasonic |
| R1-2502821 |
Discussion on ISAC channel modelling |
LG Electronics |
| R1-2502850 |
Discussion on ISAC channel modelling |
Qualcomm Incorporated |
| R1-2502923 |
Considerations on ISAC channel modelling |
CAICT |
| R1-2503080 |
Study on ISAC channel modelling |
OPPO |
| R1-2503146 |
Summary #5 on ISAC channel modelling |
Moderator (Xiaomi) |
| 9.8 |
Study on channel modelling enhancements for 7-24GHz for NR (FS_NR_7_24GHz_CHmod) |
|
| R1-2502343 |
Draft CR for Rel-19 7-24GHz Channel model |
Intel Corporation, ZTE Corporation |
| R1-2502415 |
Curve fittings for UMi & UMa scenarios: DS, ASA, ASD LOS/NLOS |
Sharp, Nokia, Ericsson, Apple, BUPT |
| R1-2503061 |
Summary #1 of discussions for draft CR for 7-24 GHz SI |
Moderator (Intel Corporation) |
| R1-2503062 |
Summary #2 of discussions for draft CR for 7-24 GHz SI |
Moderator (Intel Corporation) |
| R1-2503114 |
Session notes for 9.8 (Study on channel modelling enhancements for 7-24GHz for NR) |
Ad-Hoc Chair (CMCC) |
| R1-2503129 |
Draft CR for Rel-19 7-24GHz Channel model |
Intel Corporation, ZTE Corporation |
| 9.8.1 |
Channel model validation of TR38.901 for 7-24GHz |
|
| R1-2501749 |
Remaining Issues on Evaluation of FR3 Channel Modeling |
InterDigital, Inc. |
| R1-2501819 |
Views on channel model validation of TR38.901 for 7-24GHz |
vivo, BUPT |
| R1-2501897 |
Discussion on the channel model validation |
ZTE Corporation, Sanechips |
| R1-2501937 |
Channel model validation of TR 38.901 for 7-24 GHz |
NVIDIA |
| R1-2502004 |
On channel model validation for 7-24GHz |
CATT |
| R1-2502186 |
Discussion on channel model validation of TR38.901 for 7-24GHz |
BUPT, Spark NZ Ltd, X-Net |
| R1-2502217 |
Considerations on the 7-24GHz channel model validation |
Huawei, HiSilicon |
| R1-2502327 |
Further discussion of channel model validation of TR38.901 for 7-24GHz |
Sony |
| R1-2502339 |
Channel model validation for 7-24 GHz |
Lenovo |
| R1-2502341 |
Discussion on channel modeling verification for 7-24 GHz |
Intel Corporation |
| R1-2502380 |
Discussion on channel model validation of TR38.901 for 7 - 24 GHz |
Samsung |
| R1-2502625 |
Validation of Channel Model |
Apple |
| R1-2502737 |
Discussion on Validation of the Channel Model in 38901 |
AT&T |
| R1-2502751 |
Views on Channel model validation of TR38.901 for 7-24 GHz |
Sharp |
| R1-2502777 |
Discussion on channel model validation for 7-24 GHz |
NTT DOCOMO, INC. |
| R1-2502851 |
Channel Model Validation of TR38.901 for 7-24 GHz |
Qualcomm Incorporated |
| R1-2502878 |
Discussion on validation of channel model |
Ericsson |
| R1-2502899 |
Discussion on Channel model validation of TR38.901 for 7-24GHz |
Nokia |
| R1-2502909 |
Measurements of the angular spreads in a urban and suburban macrocells |
Vodafone, Ericsson |
| R1-2502951 |
Discussion on channel model validation of TR38.901 for 7-24GHz |
BUPT, X-Net |
| R1-2502957 |
Discussion on channel modeling verification for 7-24 GHz |
Intel Corporation |
| R1-2502986 |
Views on Channel model validation of TR38.901 for 7-24 GHz |
Sharp |
| R1-2503060 |
Data source descriptions for 7 – 24 GHz SI |
Moderator (Intel Corporation) |
| R1-2503063 |
Summary of issues for Rel-19 7-24 GHz Channel Modeling Validation |
Moderator (Intel Corporation) |
| R1-2503064 |
Summary #1 of discussions for Rel-19 7-24 GHz Channel Modeling Validation |
Moderator (Intel Corporation) |
| R1-2503065 |
Summary #2 of discussions for Rel-19 7-24 GHz Channel Modeling Validation |
Moderator (Intel Corporation) |
| R1-2503066 |
Summary #3 of discussions for Rel-19 7-24 GHz Channel Modeling Validation |
Moderator (Intel Corporation) |
| R1-2503067 |
Summary #4 of discussions for Rel-19 7-24 GHz Channel Modeling Validation |
Moderator (Intel Corporation) |
| R1-2503130 |
Summary #5 of discussions for Rel-19 7-24 GHz Channel Modeling Validation |
Moderator (Intel Corporation) |
| 9.8.2 |
Channel model adaptation/extension of TR38.901 for 7-24GHz |
|
| R1-2501750 |
Remaining Issues on Extension of FR3 Channel Modeling |
InterDigital, Inc. |
| R1-2501755 |
Discussion on channel modelling adaptation/extension for 7-24GHz |
LG Electronics |
| R1-2501820 |
Views on channel model adaptation/extension of TR38.901 for 7-24GHz |
vivo, BUPT |
| R1-2501898 |
Discussion on the channel model adaptation and extension |
ZTE Corporation, Sanechips |
| R1-2501936 |
Channel model adaptation of TR 38.901 for 7-24 GHz |
NVIDIA |
| R1-2501955 |
Discussions on FR3 Channel Modelling |
Lekha Wireless Solutions |
| R1-2502005 |
On channel model adaptation/extension for 7-24GHz |
CATT |
| R1-2502187 |
Discussion on modeling near-field propagation and spatial non-stationarity in TR38.901 for 7-24GHz |
BUPT, CMCC, X-Net |
| R1-2502218 |
Considerations on the 7-24GHz channel model extension |
Huawei, HiSilicon |
| R1-2502287 |
Channel model adaptation and extension for 7-24GHz |
OPPO |
| R1-2502328 |
Further discussion of channel model adaptation/extension of TR38.901 for 7-24GHz |
Sony |
| R1-2502340 |
Channel model extension for 7-24 GHz |
Lenovo |
| R1-2502342 |
Discussion on channel model adaptation/extension |
Intel Corporation |
| R1-2502381 |
Discussion on channel model adaptation/extension of TR38.901 for 7 - 24 GHz |
Samsung |
| R1-2502626 |
Channel Model Adaptation and Extension of TR38.901 for 7-24 GHz |
Apple |
| R1-2502852 |
Channel Model Adaptation/Extension of TR38.901 for 7-24GHz |
Qualcomm Incorporated |
| R1-2502884 |
Discussion on adaptation and extension of channel model |
Ericsson |
| R1-2502900 |
Discussion on Channel model adaptation/extension of TR38.901 for 7-24GHz |
Nokia |
| R1-2503024 |
Summary#1 of channel model adaptation and extension |
Moderator (ZTE) |
| R1-2503025 |
Summary#2 of channel model adaptation and extension |
Moderator (ZTE) |
| R1-2503026 |
Summary#3 of channel model adaptation and extension |
Moderator (ZTE) |
| R1-2503027 |
Summary#4 of channel model adaptation and extension |
Moderator (ZTE) |
| 9.9 |
NR mobility enhancements Phase 4 (NR_Mob_Ph4) |
|
| R1-2502627 |
Higher layer parameters for Rel-19 NR mobility enhancements Ph4 |
Rapporteur (Apple) |
| R1-2503140 |
Summary of RRC parameters for NR mobility enhancement WI for RAN1 120bis meeting |
Rapporteur (Apple) |
| 9.9.1 |
Measurements related enhancements for LTM |
|
| R1-2501756 |
Discussion on measurements related enhancements for LTM |
LG Electronics |
| R1-2501784 |
Discussion on measurements related enhancements for LTM |
ZTE Corporation, Sanechips |
| R1-2501821 |
Discussion on measurements related enhancements for LTM |
vivo |
| R1-2501849 |
Discussion on LTM enhancements |
TCL |
| R1-2501879 |
Discussion on measurements related enhancements for LTM |
Spreadtrum, UNISOC |
| R1-2501956 |
Discussion on measurement related enhancements for LTM |
Lekha Wireless Solutions |
| R1-2502006 |
Discussions on measurements related enhancements for LTM |
CATT |
| R1-2502087 |
FL plan for mobility enhancements in RAN1#120bis |
Moderator (Fujitsu) |
| R1-2502088 |
FL summary 1 of Measurements related enhancements for LTM |
Moderator (Fujitsu) |
| R1-2502089 |
FL summary 2 of Measurements related enhancements for LTM |
Moderator (Fujitsu) |
| R1-2502090 |
FL summary 3 of Measurements related enhancements for LTM |
Moderator (Fujitsu) |
| R1-2502091 |
Final FL summary of Measurements related enhancements for LTM |
Moderator (Fujitsu) |
| R1-2502111 |
Measurements related enhancements for LTM |
Lenovo |
| R1-2502132 |
Discussion on measurement related enhancements for LTM |
Fujitsu |
| R1-2502172 |
Discussion on measurements related enhancements for LTM |
CMCC |
| R1-2502201 |
Discussion on measurements related enhancements for LTM |
NEC |
| R1-2502206 |
Measurements related enhancements for LTM |
InterDigital, Inc. |
| R1-2502214 |
Measurements related enhancements for LTM |
Huawei, HiSilicon |
| R1-2502298 |
Discussions on measurement enhancement for LTM |
OPPO |
| R1-2502329 |
Measurements related enhancements for LTM |
Sony |
| R1-2502382 |
Views on Rel-19 measurement related enhancements for LTM |
Samsung |
| R1-2502453 |
Discussion on measurements related enhancements for LTM |
Xiaomi |
| R1-2502490 |
Discussion on measurements related enhancements for LTM |
Sharp |
| R1-2502518 |
Discussion on measurements related enhancements for LTM |
ETRI |
| R1-2502562 |
Measurement related enhancements for LTM |
Ericsson |
| R1-2502628 |
Measurement related enhancements for LTM |
Apple |
| R1-2502653 |
Measurement related enhancements for LTM |
Nokia |
| R1-2502749 |
Discussion on measurements related enhancements for LTM |
KDDI Corporation |
| R1-2502778 |
Discussion on measurement related enhancements for LTM |
NTT DOCOMO, INC. |
| R1-2502853 |
Measurements related enhancement for LTM |
Qualcomm Incorporated |
| R1-2502891 |
Discussion on measurements related enhancements for LTM |
Google |
| R1-2502929 |
LTM measurements related enhancements |
MediaTek |
| R1-2503076 |
[Draft] Reply LS on number of beam measurements in the measurement report MAC CE |
Moderator (Fujitsu) |
| R1-2503077 |
Reply LS on number of beam measurements in the measurement report MAC CE |
RAN1, Fujitsu |
| R1-2503078 |
[Draft] LS on the support of semi-persistent CSI-RS resource for LTM CSI acquisition for candidate cells |
Moderator (Fujitsu) |
| R1-2503079 |
LS on the support of semi-persistent CSI-RS resource for LTM CSI acquisition for candidate cells |
RAN1, Fujitsu |
| 9.10.1 |
Void Enabling TX/RX for XR during RRM measurements |
|
| R1-2502942 |
Discussions on scheduling enhancements considering RRM measurements for XR |
Huawei, HiSilicon |
| 9.11 |
Non-Terrestrial Networks (NTN) for NR Phase 3 and Internet of Things (IoT) Phase 3 (NR_NTN_Ph3/IoT_NTN_Ph3) |
|
| R1-2501729 |
Work plan for Rel-19 NR_NTN_Ph3 |
THALES, CATT |
| R1-2501842 |
RAN1 agreements for NR NTN Phase 3 up to RAN1#120 |
Rapporteur (THALES) |
| R1-2502056 |
Work plan for WID: introduction of IoT-NTN TDD mode |
Iridium Satellite LLC |
| R1-2502566 |
Initial RRC parameters list for Rel-19 NR NTN Phase 3 |
Rapporteur (THALES) |
| R1-2503115 |
Session notes for 9.11 (Non-Terrestrial Networks for NR Phase 3 and Internet of Things Phase 3) |
Ad-Hoc Chair (Huawei) |
| R1-2503127 |
Summary#1 of discussions on RRC parameters for Rel-19 NR NTN Phase 3 |
Moderator (Thales) |
| R1-2503128 |
Summary#2 of discussions on RRC parameters for Rel-19 NR NTN Phase 3 |
Moderator (Thales) |
| 9.11.1 |
NR-NTN downlink coverage enhancement |
|
| R1-2501723 |
NR NTN Downlink coverage enhancements |
THALES |
| R1-2501725 |
FL Summary #1: NR-NTN downlink coverage enhancements |
Moderator (THALES) |
| R1-2501726 |
FL Summary #2: NR-NTN downlink coverage enhancements |
Moderator (THALES) |
| R1-2501727 |
FL Summary #3: NR-NTN downlink coverage enhancements |
Moderator (THALES) |
| R1-2501728 |
FL Summary #4: NR-NTN downlink coverage enhancements |
Moderator (THALES) |
| R1-2501822 |
Discussion on NR-NTN downlink coverage enhancement |
vivo |
| R1-2501841 |
On NR-NTN downlink coverage enhancement |
Ericsson |
| R1-2501847 |
Discussion on downlink coverage enhancements for NR NTN |
CCU |
| R1-2501880 |
Discussion on NR-NTN downlink coverage enhancement |
Spreadtrum, UNISOC |
| R1-2501890 |
Discussion on downlink coverage enhancement for NR NTN |
Fraunhofer IIS, Fraunhofer HHI |
| R1-2501899 |
Discussion on DL coverage enhancement for NR NTN |
ZTE Corporation, Sanechips |
| R1-2501972 |
Discussion on downlink coverage enhancement for NR NTN |
CATT |
| R1-2502031 |
Further Discussion on NR NTN downlink coverage enhancement |
China Telecom |
| R1-2502082 |
NR-NTN downlink coverage enhancement |
NEC |
| R1-2502130 |
Discussion on downlink coverage enhancements |
Fujitsu |
| R1-2502173 |
Discussion on NR-NTN DL coverage enhancement |
CMCC |
| R1-2502188 |
NR-NTN downlink coverage enhancement |
InterDigital, Inc. |
| R1-2502219 |
Discussion on downlink coverage enhancements for NR NTN |
Huawei, HiSilicon |
| R1-2502265 |
Discussion on NR-NTN downlink coverage enhancement |
OPPO |
| R1-2502383 |
Discussion on downlink coverage enhancement for NR-NTN |
Samsung |
| R1-2502454 |
Discussion on NR-NTN downlink coverage enhancement |
Xiaomi |
| R1-2502473 |
Discussion on DL coverage enhancements for NR-NTN |
NICT |
| R1-2502488 |
Discussion on downlink coverage enhancement for NR NTN |
Baicells Technologies Co. Ltd |
| R1-2502519 |
Discussion on NR-NTN downlink coverage enhancement |
ETRI |
| R1-2502532 |
Discussions on downlink coverage enhancements |
Nokia, Nokia Shanghai Bell |
| R1-2502549 |
Discussion on NR-NTN downlink coverage enhancement |
TCL |
| R1-2502559 |
NR-NTN Downlink Coverage Enhancement |
Panasonic |
| R1-2502629 |
On NR-NTN Downlink Coverage Enhancement |
Apple |
| R1-2502695 |
Discussion on NR-NTN downlink coverage enhancement |
HONOR |
| R1-2502716 |
NR-NTN downlink coverage enhancement |
MediaTek Inc. |
| R1-2502727 |
Discussion on downlink coverage enhancement for NR-NTN |
CSCN |
| R1-2502779 |
Discussion on DL coverage enhancement for NR-NTN |
NTT DOCOMO, INC. |
| R1-2502815 |
Discussion on NR-NTN downlink coverage enhancement |
LG Electronics |
| R1-2502822 |
Discussion on downlink coverage enhancement for NR NTN |
Lenovo |
| R1-2502854 |
Downlink coverage enhancement for NR NTN |
Qualcomm Incorporated |
| R1-2502902 |
Discussion on Downlink Coverage Enhancement for NR NTN |
Google Korea LLC |
| R1-2502920 |
Discussion on Downlink Coverage Enhancements for NR NTN |
CEWiT |
| 9.11.2 |
Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands |
|
| R1-2501757 |
Discussion on support of HD-FDD (e)RedCap UEs with NR NTN |
SageRAN |
| R1-2501823 |
Discussion on support of RedCap and eRedCap UEs with NR-NTN |
vivo |
| R1-2501881 |
Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands |
Spreadtrum, UNISOC |
| R1-2501900 |
Discussion on support of RedCap/eRedCap UEs for NR NTN |
ZTE Corporation, Sanechips |
| R1-2501973 |
Discussion on the enhancement of RedCap and eRedCap UEs In NTN |
CATT |
| R1-2502032 |
Discussion on Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands |
China Telecom |
| R1-2502174 |
Discussion on the collision issues of HD-FDD Redcap UE in FR1-NTN |
CMCC |
| R1-2502189 |
Discussion on half-duplex RedCap issues for NTN FR1 operation |
InterDigital, Inc. |
| R1-2502220 |
Discussion on HD-FDD RedCap UEs and eRedCap UEs for FR1-NTN |
Huawei, HiSilicon |
| R1-2502266 |
Discussion on supporting of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands |
OPPO |
| R1-2502305 |
On HD-FDD Redcap UEs for NTN |
Ericsson |
| R1-2502384 |
Discussion on support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands |
Samsung |
| R1-2502455 |
Discussion on the support of Redcap and eRedcap UEs in NR NTN |
Xiaomi |
| R1-2502520 |
Discussion on HD UEs with NR NTN |
ETRI |
| R1-2502533 |
Discussion of support for RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands |
Nokia, Nokia Shanghai Bell |
| R1-2502573 |
Discussion on HD-FDD RedCap UEs and eRedCap UEs for FR1-NTN |
TCL |
| R1-2502630 |
Discussion on support of RedCap UEs with NR NTN operation |
Apple |
| R1-2502651 |
Support of (e)RedCap UEs with NR NTN |
Sharp |
| R1-2502696 |
Discussion on support of (e)RedCap UEs in NR NTN |
HONOR |
| R1-2502717 |
Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands |
MediaTek Inc. |
| R1-2502780 |
Discussion on support of RedCap and eRedCap UEs in FR1-NTN |
NTT DOCOMO, INC. |
| R1-2502816 |
Discussion on support of (e)RedCap UEs with NR-NTN operating in FR1-NTN bands |
LG Electronics |
| R1-2502855 |
Support of Redcap and eRedcap UEs in NR NTN |
Qualcomm Incorporated |
| R1-2502883 |
Support of RedCap and eRedCap UEs in NR NTN |
Nordic Semiconductor ASA |
| R1-2502924 |
Discussion on support of RedCap/eRedCap UEs in NTN |
CAICT |
| R1-2503049 |
Summary #1 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands |
Moderator (CATT) |
| R1-2503050 |
Summary #2 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands |
Moderator (CATT) |
| R1-2503051 |
Summary #3 for Support of RedCap and eRedCap UEs with NR NTN operating in FR1-NTN bands |
Moderator (CATT) |
| 9.11.3 |
NR-NTN uplink capacity/throughput enhancement |
|
| R1-2501730 |
On uplink capacity enhancement for NR-NTN |
Ericsson |
| R1-2501824 |
Discussion on NR-NTN uplink capacity enhancement |
vivo |
| R1-2501882 |
Discussion on NR-NTN uplink capacity/throughput enhancement |
Spreadtrum, UNISOC |
| R1-2501901 |
Discussion on UL capacity enhancement for NR NTN |
ZTE Corporation, Sanechips |
| R1-2501974 |
Discussion on UL capacity enhancement for NR NTN |
CATT |
| R1-2502033 |
Discussion on NR-NTN uplink enhancement |
China Telecom |
| R1-2502083 |
NR-NTN uplink capacity/throughput enhancement |
NEC |
| R1-2502131 |
Discussion on uplink capacity/cell throughput enhancement for FR1-NTN |
Fujitsu |
| R1-2502175 |
Discussion on the NR-NTN uplink capacity/throughput enhancements |
CMCC |
| R1-2502190 |
NR-NTN uplink capacity/throughput enhancement |
InterDigital, Inc. |
| R1-2502221 |
Discussion on uplink capacity/throughput enhancement for FR1-NTN |
Huawei, HiSilicon |
| R1-2502267 |
Discussion on NR-NTN uplink capacity/throughput enhancement |
OPPO |
| R1-2502385 |
Discussion on uplink capacity/throughput enhancement for NR-NTN |
Samsung |
| R1-2502409 |
Discussion on the NR-NTN uplink capacity/throughput enhancements |
TCL |
| R1-2502456 |
Discussion on NR-NTN PUSCH capacity enhancement |
Xiaomi |
| R1-2502521 |
Discussion on NR-NTN uplink capacity/throughput enhancement |
ETRI |
| R1-2502534 |
Discussion of NR-NTN uplink capacity enhancements |
Nokia, Nokia Shanghai Bell |
| R1-2502589 |
Discussion on NR-NTN Uplink Capacity/Throughput Enhancement |
Lenovo |
| R1-2502631 |
On NR-NTN Uplink Capacity Enhancement |
Apple |
| R1-2502697 |
Discussion on NR-NTN UL capacity/throughput enhancement |
HONOR |
| R1-2502698 |
Uplink capacity/throughput enhancement for NR-NTN |
Panasonic |
| R1-2502718 |
NR-NTN uplink capacity and throughput enhancements |
MediaTek Inc. |
| R1-2502781 |
Discussion on NR-NTN uplink capacity/throughput enhancement |
NTT DOCOMO, INC. |
| R1-2502817 |
Discussion on NR-NTN uplink capacity/throughput enhancement |
LG Electronics |
| R1-2502856 |
NR-NTN uplink capacity / throughput enhancement |
Qualcomm Incorporated |
| R1-2502903 |
Discussion on NR-NTN uplink capacity/throughput enhancement |
Google Korea LLC |
| R1-2502983 |
Feature lead summary #1 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements |
Moderator (MediaTek) |
| R1-2502984 |
Feature lead summary #2 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements |
Moderator (MediaTek) |
| R1-2502985 |
Feature lead summary #3 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements |
Moderator (MediaTek) |
| R1-2503070 |
Draft LS on requirements for the phase continuity and power consistency for OCC with PUSCH in NR NTN Ph3 |
Moderator (MediaTek) |
| R1-2503071 |
LS on requirements for the phase continuity and power consistency for OCC with PUSCH in NR NTN Ph3 |
RAN1, MediaTek |
| R1-2503094 |
Feature lead summary #4 of AI 9.11.3 on NR-NTN uplink capacity and throughput enhancements |
Moderator (MediaTek) |
| 9.11.4 |
IoT-NTN uplink capacity/throughput enhancement |
|
| R1-2501825 |
Discussion on IoT-NTN uplink capacity enhancement |
vivo |
| R1-2501883 |
Discussion on IoT-NTN uplink capacity/throughput enhancement |
Spreadtrum, UNISOC |
| R1-2501902 |
Discussion on UL capacity enhancement for IoT NTN |
ZTE Corporation, Sanechips |
| R1-2501975 |
Discussion on UL capacity enhancement for IoT NTN |
CATT |
| R1-2502084 |
IoT-NTN uplink capacity/throughput enhancement |
NEC |
| R1-2502094 |
IoT-NTN uplink capacity enhancement |
Nokia, Nokia Shanghai Bell |
| R1-2502176 |
Discussion on the IoT-NTN uplink capacity/throughput enhancements |
CMCC |
| R1-2502191 |
IoT-NTN uplink capacity/throughput enhancement |
InterDigital, Inc. |
| R1-2502222 |
Discussion on UL capacity enhancements for IoT NTN |
Huawei, HiSilicon |
| R1-2502268 |
Discussion on IoT-NTN uplink capacity/throughput enhancement |
OPPO |
| R1-2502306 |
On uplink capacity enhancements for IoT-NTN |
Ericsson |
| R1-2502330 |
On IoT-NTN uplink capacity enhancements |
Sony |
| R1-2502331 |
FL Summary #1 for IoT-NTN |
Moderator (Sony) |
| R1-2502332 |
FL Summary #2 for IoT-NTN |
Moderator (Sony) |
| R1-2502333 |
Final FL Summary for IoT-NTN |
Moderator (Sony) |
| R1-2502344 |
IoT NTN OCC signaling for NPUSCH |
Sharp |
| R1-2502386 |
Discussion on uplink capacity/throughput enhancement for IoT-NTN |
Samsung |
| R1-2502457 |
Discussion on IoT-NTN uplink capacity enhancement |
Xiaomi |
| R1-2502522 |
Discussion on uplink capacity/throughput enhancement for IoT NTN |
ETRI |
| R1-2502560 |
Discussion on the IoT-NTN uplink capacity/throughput enhancements |
TCL |
| R1-2502632 |
Discussion on IoT-NTN Uplink Capacity Enhancement |
Apple |
| R1-2502719 |
IoT-NTN uplink capacity and throughput enhancement |
MediaTek Inc. |
| R1-2502818 |
Discussion on IoT-NTN uplink capacity/throughput enhancement |
LG Electronics |
| R1-2502823 |
Discussion on uplink capacity enhancement for IoT NTN |
Lenovo |
| R1-2502857 |
IOT-NTN uplink capacity/throughput enhancement |
Qualcomm Incorporated |
| R1-2502882 |
IoT-NTN uplink capacity/throughput enhancement |
Nordic Semiconductor ASA |
| R1-2503122 |
FL Summary #3 for IoT-NTN |
Moderator (Sony) |
| 9.11.5 |
IoT-NTN TDD mode (IoT_NTN_TDD-Core) |
|
| R1-2501724 |
Discussion on IoT-NTN TDD mode |
THALES |
| R1-2501826 |
Discussion on IoT-NTN TDD mode |
vivo |
| R1-2501884 |
Discussion on IoT-NTN TDD mode |
Spreadtrum, UNISOC |
| R1-2501903 |
Discussion on the IoT-NTN TDD mode |
ZTE Corporation, Sanechips |
| R1-2501976 |
Discussion on Physical layer design of IoT-NTN TDD |
CATT |
| R1-2502057 |
Remaining aspects of loT-NTN TDD mode |
Iridium Satellite LLC |
| R1-2502059 |
Stage 2 proposal (for RAN2 TS 36.300) for Introduction of IoT-NTN TDD mode |
Iridium Satellite LLC |
| R1-2502095 |
Discussion on IoT-NTN TDD mode |
Nokia, Nokia Shanghai Bell |
| R1-2502177 |
Discussion on the new NB-IoT NTN TDD mode |
CMCC |
| R1-2502223 |
Discussion on IoT-NTN TDD mode |
Huawei, HiSilicon |
| R1-2502269 |
Discussion on IoT-NTN TDD mode |
OPPO |
| R1-2502345 |
IoT NTN TDD guard period and uplink segmentation |
Sharp |
| R1-2502387 |
Discussion on IoT-NTN TDD mode |
Samsung |
| R1-2502458 |
Discussion on IoT-NTN TDD mode |
Xiaomi |
| R1-2502633 |
Discussion on IoT-NTN TDD mode |
Apple |
| R1-2502782 |
Discussion on IoT-NTN TDD mode |
NTT DOCOMO, INC. |
| R1-2502819 |
Discussion on IoT-NTN TDD mode |
LG Electronics |
| R1-2502824 |
Discussion on IoT-NTN TDD mode |
Lenovo |
| R1-2502858 |
IOT-NTN TDD mode |
Qualcomm Incorporated |
| R1-2502881 |
On R19 TDD IoT-NTN |
Nordic Semiconductor ASA |
| R1-2502999 |
Feature lead summary #1 on IoT-NTN TDD mode |
Moderator (Qualcomm Incorporated) |
| R1-2503081 |
Feature lead summary #2 on IoT-NTN TDD mode |
Moderator (Qualcomm Incorporated) |
| R1-2503101 |
Feature lead summary #3 on IoT-NTN TDD mode |
Moderator (Qualcomm Incorporated) |
| R1-2503141 |
[DRAFT] LS on precompensation for NB-IoT NTN TDD mode |
Qualcomm Incorporated |
| R1-2503142 |
LS on precompensation for NB-IoT NTN TDD mode |
RAN1, Qualcomm Incorporated |
| 9.12 |
Multi-Carrier Enhancements |
|
| R1-2501891 |
High layer parameters for Rel-19 Multi-Carrier Enhancements |
Lenovo (Rapporteur) |
| R1-2503116 |
Session notes for 9.12 (Multi-Carrier Enhancements for NR Phase 2) |
Ad-Hoc Chair (CMCC) |
| 9.12.1 |
Multi-Carrier Enhancements for NR Phase 3 (NR_MC_enh2) |
|
| R1-2501827 |
Discussion on enhancement of multi-cell PUSCH/PDSCH |
vivo |
| R1-2501885 |
Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI |
Spreadtrum, UNISOC |
| R1-2501892 |
Discussion on multi-cell scheduling with a single DCI |
Lenovo |
| R1-2501910 |
Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI |
ZTE Corporation, Sanechips |
| R1-2501960 |
Multi-cell PxSCH scheduling with a single DCI |
Ericsson |
| R1-2501977 |
Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI |
CATT |
| R1-2502034 |
Discussion on multi-carrier enhancements for NR phase 3 |
China Telecom |
| R1-2502215 |
Discussion on Rel-19 Multi-carrier enhancements |
Huawei, HiSilicon |
| R1-2502282 |
Discussion of multi-cell scheduling with a single DCI |
OPPO |
| R1-2502388 |
Enhancements for multi-cell PUSCH/PDSCH scheduling |
Samsung |
| R1-2502484 |
Discussion on single DCI based multi-cell scheduling for Rel-19 |
LG Electronics |
| R1-2502493 |
Discussion on multi-carrier enhancements for NR Phase 3 |
Panasonic |
| R1-2502495 |
Remaining details on Rel-19 Multi-carrier enhancements |
Nokia |
| R1-2502574 |
Discussion on Multi-cell PUSCHPDSCH scheduling with a single DCI |
TCL |
| R1-2502720 |
Multi-carrier enhancements for NR phase 3 |
MediaTek Inc. |
| R1-2502783 |
Discussion on multi-cell PUSCH/PDSCH scheduling with a single DCI |
NTT DOCOMO, INC. |
| R1-2502859 |
Multi-cell PUSCH/PDSCH scheduling with a single DCI |
Qualcomm Incorporated |
| R1-2502998 |
Multi-carrier enhancements for NR phase 3 |
MediaTek Inc. |
| R1-2503037 |
Feature lead summary#1 on multi-cell scheduling with a single DCI |
Moderator (Lenovo) |
| R1-2503038 |
Feature lead summary#2 on multi-cell scheduling with a single DCI |
Moderator (Lenovo) |
| R1-2503039 |
Feature lead summary#3 on multi-cell scheduling with a single DCI |
Moderator (Lenovo) |
| 9.12.2 |
Low band carrier aggregation via switching (NR_LBCA_Sw) |
|
| R1-2501828 |
Discussion on Low band carrier aggregation via switching |
vivo |
| R1-2501886 |
Discussion on low band carrier aggregation via switching |
Spreadtrum, UNISOC |
| R1-2501893 |
Discussion on carrier switching pattern for low band carrier aggregation via switching |
Lenovo |
| R1-2501911 |
Discussion on low band carrier aggregation via switching |
ZTE Corporation, Sanechips |
| R1-2501978 |
Discussion on low band carrier aggregation via switching |
CATT |
| R1-2502046 |
Discussion on a low-band CA with switching |
Ofinno |
| R1-2502203 |
Discussion on low band carrier aggregation via switching |
NEC |
| R1-2502216 |
Discussion on low band CA via switching |
Huawei, HiSilicon |
| R1-2502283 |
Discussion of low-band CA via switching |
OPPO |
| R1-2502389 |
Discussion on low band carrier aggregation via switching |
Samsung |
| R1-2502426 |
Low band carrier aggregation through switching |
Ericsson |
| R1-2502485 |
Discussion on low band CA operation via switching for Rel-19 |
LG Electronics |
| R1-2502496 |
Principles for low-band CA via switching |
Nokia |
| R1-2502575 |
Discussion on Low band carrier aggregation via switching |
TCL |
| R1-2502634 |
On low-band carrier aggregation via switching |
Apple |
| R1-2502635 |
FL summary #1 of Low band carrier aggregation via switching |
Moderator (Apple) |
| R1-2502636 |
FL summary #2 of Low band carrier aggregation via switching |
Moderator (Apple) |
| R1-2502637 |
FL summary #3 of Low band carrier aggregation via switching |
Moderator (Apple) |
| R1-2502721 |
Low band carrier aggregation via switching |
MediaTek Inc. |
| R1-2502784 |
Discussion on Low band carrier aggregation via switching |
NTT DOCOMO, INC. |
| R1-2502860 |
Low band carrier aggregation via switching |
Qualcomm Incorporated |
| R1-2503110 |
FL summary #4 of Low band carrier aggregation via switching |
Moderator (Apple) |
| 9.13 |
LTE-based 5G Broadcast Phase 2 (LTE_terr_bcast_Ph2) |
|
| R1-2502548 |
Higher layer parameters for Rel-19 LTE-based 5G Broadcast after RAN1#120 |
EBU |
| R1-2503117 |
Session notes for 9.13 (LTE-based 5G Broadcast Phase 2) |
Ad-Hoc Chair (Huawei) |
| 9.13.1 |
Time-frequency interleaver design for MBMS dedicated cells |
|
| R1-2501912 |
Discussion on time-frequency interleaver design for LTE-based 5G Broadcast |
ZTE Corporation, Sanechips |
| R1-2502209 |
On time-frequency interleavers for LTE-based 5G Broadcast |
Huawei, HiSilicon |
| R1-2502390 |
Views on LTE-based 5G broadcast |
Samsung |
| R1-2502546 |
Further details on open issues regarding TFI for LTE-based 5G Broadcast |
EBU |
| R1-2502582 |
Design of Time-frequency interleaver for 5G Broadcast |
Shanghai Jiao Tong University |
| R1-2502861 |
Time and Frequency Interleaving for 5G Broadcast |
Qualcomm Incorporated |
| R1-2503001 |
FL summary#1 on Rel-19 LTE-based 5G Broadcast Phase 2 |
Moderator (EBU) |
| R1-2503002 |
FL summary#2 on Rel-19 LTE-based 5G Broadcast Phase 2 |
Moderator (EBU) |
| R1-2503003 |
FL summary#3 on Rel-19 LTE-based 5G Broadcast Phase 2 |
Moderator (EBU) |
| R1-2503143 |
Final summary on Rel-19 LTE-based 5G Broadcast Phase 2 |
Moderator (EBU) |
| 9.14 |
TEI |
|
| R1-2501787 |
On Rel-19 TEI proposals |
ZTE Corporation, Sanechips |
| R1-2502550 |
Rel-19 TEI on muting of always-on signals for 5G Broadcast |
EBU |
| R1-2502638 |
Higher layer parameters for Rel-19 TEI SRSCS_ULTxSwitch |
Apple |
| R1-2502722 |
Proposal for TEI19 |
MediaTek Inc. |
| R1-2502748 |
Enhancement of SRS antenna switching pattern reporting |
CATT |
| R1-2502862 |
Proposal for Rel-19 RAN1 TEI |
Qualcomm Incorporated |
| R1-2502995 |
Rel-19 TEI on muting of always-on signals for 5G Broadcast |
EBU |
| R1-2503009 |
FL Summary #1 on Rel-19 TEIs |
Moderator (NTT DOCOMO, INC.) |
| R1-2503010 |
FL Summary #2 on Rel-19 TEIs |
Moderator (NTT DOCOMO, INC.) |
| R1-2503073 |
Proposal for Rel-19 RAN1 TEI |
Qualcomm, Apple, Verizon, ZTE |
| R1-2503095 |
FL Summary #3 on Rel-19 TEIs |
Moderator (NTT DOCOMO, INC.) |
| R1-2503118 |
Session notes for 9.14 (TEI19) |
Ad-Hoc Chair (CMCC) |
| 9.15 |
Rel-19 UE Features |
|
| R1-2502977 |
Updated RAN1 UE features list for Rel-19 NR after RAN1 #120bis |
Moderators (AT&T, NTT DOCOMO, INC.) |
| R1-2502978 |
Draft LS on updated Rel-19 RAN1 UE features lists for NR after RAN1#120bis |
Moderators (AT&T, NTT DOCOMO, INC.) |
| R1-2502979 |
LS on updated Rel-19 RAN1 UE features lists for NR after RAN1#120bis |
RAN1, AT&T, NTT DOCOMO, INC. |
| R1-2502980 |
Initial RAN1 UE features list for Rel-19 LTE after RAN1 #120bis |
Moderators (AT&T, NTT DOCOMO, INC.) |
| R1-2502981 |
Draft LS on initial Rel-19 RAN1 UE features lists for LTE after RAN1#120bis |
Moderators (AT&T, NTT DOCOMO, INC.) |
| R1-2502982 |
LS on initial Rel-19 RAN1 UE features lists for LTE after RAN1#120bis |
RAN1, AT&T, NTT DOCOMO, INC. |
| 9.15.1 |
UE features for AI/ML for NR Air Interface |
|
| R1-2501829 |
Discussion on UE features for AI/ML for NR Air Interface |
vivo |
| R1-2501920 |
Discussion on UE features for AI/ML for NR Air Interface |
ZTE Corporation, Sanechips |
| R1-2501979 |
Discussion on UE features for AI/ML for NR Air Interface |
CATT, CICTCI |
| R1-2502047 |
Views on UE features for AI/ML for NR Air Interface |
Ofinno |
| R1-2502102 |
Discussions on UE features for AI/ML for NR Air Interface |
LG Electronics |
| R1-2502133 |
Views on UE features for AI/ML for NR Air Interface |
Nokia |
| R1-2502178 |
Discussion on UE features for AI/ML for NR air Interface |
CMCC |
| R1-2502246 |
UE features for AI/ML for NR air interface |
Huawei, HiSilicon |
| R1-2502292 |
UE features for AIML for NR air interface |
OPPO |
| R1-2502391 |
UE features for AI/ML for NR Air Interface |
Samsung |
| R1-2502459 |
Discussion on UE features for AI/ML for NR Air Interface |
Xiaomi |
| R1-2502639 |
View on UE features for R19 AI/ML for NR Air Interface |
Apple |
| R1-2502661 |
UE Features for Rel-19 AI/ML for NR Air Interface |
Ericsson |
| R1-2502738 |
Summary of UE features for AI/ML for NR Air Interface |
Moderator (AT&T) |
| R1-2502785 |
Discussion on UE features for AI/ML for NR Air Interface |
NTT DOCOMO, INC. |
| R1-2502863 |
Rapporteur's view on Rel-19 UE features for AI/ML air interface |
Qualcomm Incorporated |
| R1-2502864 |
UE features for AI/ML for NR air interface |
Qualcomm Incorporated |
| R1-2502959 |
Session Notes of AI 9.15.1 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503131 |
Final Summary of UE features for AI/ML for NR Air Interface |
Moderator (AT&T) |
| 9.15.2 |
UE features for NR MIMO Phase 5 |
|
| R1-2501732 |
UE features for NR MIMO Phase 5 |
MediaTek Inc. |
| R1-2501785 |
Discussion on UE features for NR MIMO Phase 5 |
ZTE Corporation, Sanechips |
| R1-2501830 |
Discussion on UE features for NR MIMO Phase 5 |
vivo |
| R1-2501980 |
UE features for NR MIMO Phase 5 |
CATT |
| R1-2502048 |
Views on UE features for MIMO Ph5 |
Ofinno |
| R1-2502134 |
Views on NR MIMO Phase 5 UE features |
Nokia |
| R1-2502179 |
Discussion on UE features for NR MIMO Phase 5 |
CMCC |
| R1-2502228 |
UE features for NR MIMO Phase 5 |
Huawei, HiSilicon |
| R1-2502297 |
UE features for NR MIMO Phase 5 |
OPPO |
| R1-2502392 |
UE features for NR MIMO Phase 5 |
Samsung |
| R1-2502460 |
Discussion on UE features for NR MIMO Phase 5 |
Xiaomi |
| R1-2502640 |
Views on UE features for NR MIMO Phase 5 |
Apple |
| R1-2502739 |
Summary of UE features for NR MIMO Phase 5 |
Moderator (AT&T) |
| R1-2502786 |
Discussion on UE features for NR MIMO Phase 5 |
NTT DOCOMO, INC. |
| R1-2502810 |
UE features for NR MIMO Phase 5 |
Ericsson |
| R1-2502865 |
UE features for NR MIMO phase 5 |
Qualcomm Incorporated |
| R1-2502960 |
Session Notes of AI 9.15.2 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503132 |
Final Summary of UE features for NR MIMO Phase 5 |
Moderator (AT&T) |
| 9.15.3 |
UE features for evolution of NR duplex operation: SBFD |
|
| R1-2501831 |
Discussion on UE features for evolution of NR duplex operation: SBFD |
vivo |
| R1-2501887 |
Discussion on UE features for evolution of NR duplex operation: SBFD |
Spreadtrum, UNISOC |
| R1-2501913 |
Discussion on UE features for Rel-19 SBFD |
ZTE Corporation, Sanechips |
| R1-2501981 |
UE features for SBFD |
CATT |
| R1-2502049 |
Discussion on Rel-19 NR UE features for evolution of NR duplex operation |
Ofinno |
| R1-2502135 |
Views on SBFD UE features |
Nokia |
| R1-2502143 |
Discussion on UE features for evolution of NR duplex operation |
MediaTek Inc |
| R1-2502180 |
Discussion on UE features for evolution of NR duplex operation: SBFD |
CMCC |
| R1-2502244 |
UE features for evolution of NR duplex operation |
Huawei, HiSilicon |
| R1-2502280 |
Discussion on UE features for Rel-19 NR Duplex |
OPPO |
| R1-2502393 |
UE features for Rel-19 Duplex Evolution for NR |
Samsung |
| R1-2502425 |
UE-features for SBFD |
Ericsson |
| R1-2502461 |
UE features for SBFD |
Xiaomi |
| R1-2502641 |
Views on UE features for Rel-19 SBFD |
Apple |
| R1-2502787 |
Discussion on UE features for evolution of NR duplex operation |
NTT DOCOMO, INC. |
| R1-2502866 |
UE features for evolution of NR duplex operation |
Qualcomm Incorporated |
| R1-2502965 |
Session Notes of AI 9.15.3 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502971 |
Summary of discussion on Rel-19 NR UE features for SBFD |
Moderator (NTT DOCOMO, INC.) |
| R1-2503068 |
Summary#2 of discussion on Rel-19 NR UE features for SBFD |
Moderator (NTT DOCOMO, INC.) |
| 9.15.4 |
UE features for enhancements of network energy savings for NR |
|
| R1-2501770 |
Discussion on NES features |
ZTE Corporation, Sanechips |
| R1-2501832 |
Discussions on UE features for enhancements of network energy savings for NR |
vivo |
| R1-2501932 |
Discussion of Rel-19 NES UE Features |
FUTUREWEI |
| R1-2501982 |
Discussion on UE features for Rel-19 NES |
CATT |
| R1-2502035 |
Discussion on UE features for Rel-19 Network Energy Saving |
China Telecom |
| R1-2502050 |
UE features for enhancements of network energy savings for NR |
Ofinno |
| R1-2502136 |
Views on Network Energy Saving Enhancement UE features |
Nokia |
| R1-2502181 |
Discussion on UE features for enhancements of network energy savings for NR |
CMCC |
| R1-2502232 |
UE features for Rel-19 NES |
Huawei, HiSilicon |
| R1-2502264 |
Discussion on UE features for enhancements of network energy savings for NR |
OPPO |
| R1-2502394 |
UE features for enhancements of network energy savings for NR |
Samsung |
| R1-2502462 |
UE features for NES enhancements |
Xiaomi |
| R1-2502486 |
Discussion on UE features for enhancements of NES |
LG Electronics |
| R1-2502642 |
Views on UE features for Rel-19 NES |
Apple |
| R1-2502740 |
Summary of UE features for enhancements of network energy savings for NR |
Moderator (AT&T) |
| R1-2502788 |
Discussion on UE features for eNES |
NTT DOCOMO, INC. |
| R1-2502808 |
UE features for R19 NES |
Ericsson |
| R1-2502867 |
UE features for Rel-19 NES |
Qualcomm Incorporated |
| R1-2502961 |
Session Notes of AI 9.15.4 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503133 |
Final Summary of UE features for enhancements of network energy savings for NR |
Moderator (AT&T) |
| 9.15.5 |
UE features for LP-WUS/WUR for NR |
|
| R1-2501712 |
Views on UE Features for LP-WUS |
FUTUREWEI |
| R1-2501771 |
Discussion on WUR features |
ZTE Corporation, Sanechips |
| R1-2501833 |
UE features for Rel-19 LP-WUS/WUR |
vivo |
| R1-2501983 |
LP-WUS/WUR UE feature |
CATT |
| R1-2502137 |
Views on LP-WUS/WUR UE features |
Nokia |
| R1-2502182 |
Discussion on UE features for low-power wake-up signal and receiver for NR |
CMCC |
| R1-2502240 |
UE features for Rel-19 LP-WUS |
Huawei, HiSilicon |
| R1-2502260 |
Discussion for UE features of LP-WUS/WUR |
OPPO |
| R1-2502395 |
Discussion on UE features for LP-WUS/WUR |
Samsung |
| R1-2502463 |
UE features for NR LP-WUS/WUR |
Xiaomi |
| R1-2502487 |
UE features for LP-WUS/WUR for NR |
LG Electronics |
| R1-2502643 |
On Rel-19 LP-WUS/WUR UE features |
Apple |
| R1-2502724 |
UE features for LP-WUS/WUR for NR |
MediaTek Inc. |
| R1-2502789 |
Discussion on UE features for LP-WUS/WUR for NR |
NTT DOCOMO, INC. |
| R1-2502809 |
UE features for Rel-19 LP-WUS/WUR WI |
Ericsson |
| R1-2502868 |
UE features for LP-WUS/WUR for NR |
Qualcomm Incorporated |
| R1-2502910 |
UE Features for LP-WUS |
Vodafone, Deutsche Telekom |
| R1-2502966 |
Session Notes of AI 9.15.5 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502972 |
Summary of discussion on Rel-19 NR UE features for LP-WUS/WUR |
Moderator (NTT DOCOMO, INC.) |
| R1-2503084 |
Summary#2 of discussion on Rel-19 NR UE features for LP-WUS/WUR |
Moderator (NTT DOCOMO, INC.) |
| 9.15.6 |
UE features for NR mobility enhancements Phase 4 |
|
| R1-2501786 |
Discussion on UE features for NR mobility enhancements Phase 4 |
ZTE Corporation, Sanechips |
| R1-2501834 |
Discussion on UE features for NR mobility enhancements Phase 4 |
vivo |
| R1-2501984 |
Discussion on UE features for NR mobility enhancements Phase 4 |
CATT |
| R1-2502138 |
UE Features for NR mobility enhancements Phase 4 |
Nokia |
| R1-2502183 |
Discussion on UE features for NR mobility enhancements Phase 4 |
CMCC |
| R1-2502247 |
UE features for NR mobility enhancements phase 4 |
Huawei, HiSilicon |
| R1-2502299 |
Discussion on UE features for NR mobility enhancements |
OPPO |
| R1-2502396 |
UE features for NR mobility enhancements Phase 4 |
Samsung |
| R1-2502464 |
Discussion on UE features for NR mobility enhancements Phase 4 |
Xiaomi |
| R1-2502563 |
UE features for NR mobility enhancements phase 4 |
Ericsson |
| R1-2502644 |
Rapporteur input on UE features for Rel-19 NR Mobility enhancements Ph4 |
Apple |
| R1-2502741 |
Summary of UE features for NR mobility enhancements Phase 4 |
Moderator (AT&T) |
| R1-2502790 |
Discussion on UE features for NR mobility enhancements Phase4 |
NTT DOCOMO, INC. |
| R1-2502869 |
UE features for NR mobility enhancements Phase 4 |
Qualcomm Incorporated |
| R1-2502962 |
Session Notes of AI 9.15.6 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503134 |
Final Summary of UE features for NR mobility enhancements Phase 4 |
Moderator (AT&T) |
| 9.15.8 |
UE features for NTN for NR Phase 3 |
|
| R1-2501835 |
Discussion on UE features for NTN for NR Phase 3 |
vivo |
| R1-2501888 |
Discussion on UE features for NTN for NR |
Spreadtrum, UNISOC |
| R1-2501942 |
Discussion on the UE feature for NR-NTN Phase-3 |
ZTE Corporation, Sanechips |
| R1-2502139 |
Views on Rel-19 NTN phase 3 UE features |
Nokia |
| R1-2502184 |
Discussion on UE features for UE features for NTN for NR Phase 3 |
CMCC |
| R1-2502248 |
UE features for NTN for NR phase 3 |
Huawei, HiSilicon |
| R1-2502270 |
Discussion on UE features for NTN for NR Phase 3 |
OPPO |
| R1-2502307 |
On UE features for NR-NTN Phase 3 |
Ericsson |
| R1-2502397 |
UE features for NTN for NR Phase 3 |
Samsung |
| R1-2502645 |
On Rel-19 NR-NTN UE Features |
Apple |
| R1-2502791 |
Discussion on UE features for Rel-19 NR NTN |
NTT DOCOMO, INC. |
| R1-2502870 |
UE features for NR NTN |
Qualcomm Incorporated |
| R1-2502931 |
Initial UE features list for Rel-19 NR NTN Phase 3 |
Rapporteur (THALES) |
| R1-2502967 |
Session Notes of AI 9.15.8 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502973 |
Summary of discussion on Rel-19 NR UE features for NR-NTN Phase 3 |
Moderator (NTT DOCOMO, INC.) |
| R1-2503074 |
Summary#2 of discussion on Rel-19 NR UE features for NR-NTN Phase 3 |
Moderator (NTT DOCOMO, INC.) |
| 9.15.9 |
UE features for NTN for Internet of Things (IoT) Phase 3 |
|
| R1-2501836 |
Discussion on UE features for NTN for IoT Phase 3 |
vivo |
| R1-2501943 |
Discussion on the UE feature for IoT-NTN Phase-3 |
ZTE Corporation, Sanechips |
| R1-2502140 |
Views on Rel-19 NTN for Internet of Things (IoT) Phase 3 UE features |
Nokia |
| R1-2502185 |
Discussion on UE features for NTN for IoT Phase 3 |
CMCC |
| R1-2502249 |
UE features for IoT-NTN Phase 3 |
Huawei, HiSilicon |
| R1-2502271 |
Discussion on UE features for NTN for Internet of Things Phase 3 |
OPPO |
| R1-2502308 |
On UE features for IoT-NTN Phase 3 |
Ericsson |
| R1-2502398 |
UE features for NTN for Internet of Things (IoT) Phase 3 |
Samsung |
| R1-2502646 |
On Rel-19 IoT-NTN UE Features |
Apple |
| R1-2502871 |
UE features for NTN IOT |
Qualcomm Incorporated |
| R1-2502968 |
Session Notes of AI 9.15.9 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502974 |
Summary of discussion on Rel-19 LTE UE features for IoT-NTN Phase 3 |
Moderator (NTT DOCOMO, INC.) |
| 9.15.10 |
UE features for IoT-NTN TDD mode |
|
| R1-2501837 |
Discussion on UE features for IoT-NTN TDD mode |
vivo |
| R1-2501944 |
Discussion on the UE feature for IoT-NTN TDD |
ZTE Corporation, Sanechips |
| R1-2502058 |
UE features for IoT-NTN TDD mode |
Iridium Satellite LLC |
| R1-2502141 |
Views on Rel-19 NTN for Internet of Things (IoT) TDD mode UE features |
Nokia |
| R1-2502250 |
UE features for IoT-NTN TDD mode |
Huawei, HiSilicon |
| R1-2502272 |
Discussion on UE features for IoT-NTN TDD mode |
OPPO |
| R1-2502399 |
UE features for IoT-NTN TDD mode |
Samsung |
| R1-2502647 |
On Rel-19 IoT-NTN TDD mode UE Features |
Apple |
| R1-2502872 |
UE features for IOT-NTN TDD mode |
Qualcomm Incorporated |
| R1-2502969 |
Session Notes of AI 9.15.10 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502975 |
Summary of discussion on Rel-19 LTE UE features for IoT-NTN TDD mode |
Moderator (NTT DOCOMO, INC.) |
| R1-2503075 |
Summary#2 of discussion on Rel-19 LTE UE features for IoT-NTN TDD mode |
Moderator (NTT DOCOMO, INC.) |
| 9.15.11 |
UE features for MCE for NR Phase 3 |
|
| R1-2501838 |
Discussion on UE features for MCE for NR Phase 3 |
vivo |
| R1-2501889 |
Discussion on UE features for MCE |
Spreadtrum, UNISOC |
| R1-2501894 |
Discussion on UE feature for Rel-19 Multi-Carrier Enhancements |
Lenovo (Rapporteur) |
| R1-2501914 |
Discussion on UE features for Rel-19 MCE |
ZTE Corporation, Sanechips |
| R1-2502142 |
Initial views on NR Multi-carrier Enhancements Phase 2 UE features |
Nokia |
| R1-2502251 |
UE features for Rel-19 MCE |
Huawei, HiSilicon |
| R1-2502284 |
Discussion on UE feature for multi-cell scheduling with a single DCI |
OPPO |
| R1-2502400 |
UE features for multi-carrier enhancements |
Samsung |
| R1-2502648 |
On UE features for Rel-19 multi-carrier enhancements |
Apple |
| R1-2502723 |
UE features for MCE for NR Phase 3 |
MediaTek Inc. |
| R1-2502792 |
Discussion on UE features for multi-cell PUSCH/PDSCH scheduling with a single DCI |
NTT DOCOMO, INC. |
| R1-2502873 |
UE features for MCE for NR Phase 2 |
Qualcomm Incorporated |
| R1-2502970 |
Session Notes of AI 9.15.11 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2502976 |
Summary of discussion on Rel-19 NR UE features for MCE for NR Phase 3 |
Moderator (NTT DOCOMO, INC.) |
| R1-2503069 |
Summary#2 of discussion on Rel-19 NR UE features for MCE for NR Phase 3 |
Moderator (NTT DOCOMO, INC.) |
| R1-2503138 |
Summary#3 of discussion on Rel-19 NR UE features for MCE for NR Phase 3 |
Moderator (NTT DOCOMO, INC.) |
| 9.15.13 |
UE features for LTE based 5G broadcast Phase 2 |
|
| R1-2501915 |
Discussion on UE features for Rel-19 LTE based 5G broadcast |
ZTE Corporation, Sanechips |
| R1-2502252 |
UE features for LTE based 5G broadcast Phase 2 |
Huawei, HiSilicon |
| R1-2502401 |
UE features for LTE-based 5G broadcast |
Samsung |
| R1-2502547 |
UE feature list for Rel-19 LTE-based 5G Broadcast after RAN1#120 |
EBU |
| R1-2502742 |
Summary of UE features for LTE based 5G broadcast Phase 2 |
Moderator (AT&T) |
| R1-2502874 |
UE features for LTE-based 5G Broadcast Phase 2 |
Qualcomm Incorporated |
| R1-2502963 |
Session Notes of AI 9.15.13 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503135 |
Final Summary of UE features for LTE based 5G broadcast Phase 2 |
Moderator (AT&T) |
| 9.15.14 |
Others |
|
| R1-2501916 |
Discussion on UE features for Rel-19 TEIs |
ZTE Corporation, Sanechips |
| R1-2502253 |
UE features for TEI-19 features |
Huawei, HiSilicon |
| R1-2502649 |
UE features for Rel-19 TEI SRSCS_ULTxSwitch |
Apple |
| R1-2502743 |
Summary of UE features for Rel-19 TEI and other relevant issues |
Moderator (AT&T) |
| R1-2502875 |
UE features for Rel-19 TEI |
Qualcomm Incorporated |
| R1-2502964 |
Session Notes of AI 9.15.14 |
Ad-Hoc Chair (NTT DOCOMO, INC.) |
| R1-2503136 |
Final Summary of UE features for Rel-19 TEI and other relevant issues |
Moderator (AT&T) |